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Articles 1 - 5 of 5

Full-Text Articles in Mechanical Engineering

Design And Testing Of A Pumpless Microelectromechanical System Nanoinjector, Quentin Theodore Aten Nov 2008

Design And Testing Of A Pumpless Microelectromechanical System Nanoinjector, Quentin Theodore Aten

Theses and Dissertations

A deeper understanding of human development and disease is made possible partly through the study of genetically modified model organisms, such as the common mouse (Mus musculus). By genetically modifying such model organisms, scientists can activate, deactivate, or highlight particular characteristics. A genetically modified animal is generated by adding exogenous (foreign) genetic material to one or more embryonic cells at their earliest stages of development. Frequently, this exogenous genetic material consists of specially engineered DNA, which is introduced into a fertilized egg cell (zygote). When successfully introduced into the zygote, the exogenous DNA will be incorporated into the cell's ...


Multi-Physics Modeling And Calibration For Self-Sensing Of Thermomechanical In-Plane Microactuators, Kendall B. Teichert Jul 2008

Multi-Physics Modeling And Calibration For Self-Sensing Of Thermomechanical In-Plane Microactuators, Kendall B. Teichert

Theses and Dissertations

As technology advances and engineering capabilities improve, more research has focused on microscopic possibilities. Microelectromechanical systems (MEMS) is one area that has received much attention recently. Within MEMS much research has focused on sensing and actuation. This thesis presents work on a particular actuator of interest, the thermomechanical in-plane microactuator (TIM). Recent work has shown the possibility of a novel approach of sensing mechanical outputs of the TIM without ancillary sensors. This sensing approach exploits the piezoresistive property of silicon. However, to implement this approach a full model of the TIM would need to be obtained to describe the physics ...


Observations Of Piezoresistivity For Polysilicon In Bending That Are Unexplained By Linear Models, Tyler L. Waterfall, Gary K. Johns, Robert K. Messenger, Brian D. Jensen, Timothy W. Mclain, Larry L. Howell Feb 2008

Observations Of Piezoresistivity For Polysilicon In Bending That Are Unexplained By Linear Models, Tyler L. Waterfall, Gary K. Johns, Robert K. Messenger, Brian D. Jensen, Timothy W. Mclain, Larry L. Howell

Faculty Publications

Compliant piezoresistive MEMS sensors exhibit great promise for improved on-chip sensing. As compliant sensors may experience complex loads, their design and implementation require a greater understanding of the piezoresistive effect of polysilicon in bending and combined loads. This paper presents experimental results showing the piezoresistive effect for these complex loads. Several n-type polysilicon test structures, fabricated in MUMPs and SUMMiT processes, were tested. Results show that, while tensile stresses cause a linear decrease in resistance, bending stresses induce a nonlinear rise in resistance, contrary to the effect predicted by linear models. In addition, tensile, compressive, and bending loads combine in ...


Characterizing The Three-Dimensional Behavior Of Bistable Micromechanisms, Brian B. Cherry Feb 2008

Characterizing The Three-Dimensional Behavior Of Bistable Micromechanisms, Brian B. Cherry

Theses and Dissertations

Compliant bistable micromechanisms have been proposed for use in applications such as switches, relays, shutters, and sensing arrays. Unpublished laboratory testing suggests that off-axis forces may affect the bistable nature of fully compliant bistable micromechanisms (FCBMs). The actuation forces required to snap the FCBM from one stable equilibrium position to another can be altered if the off-axis forces are applied to the mechanism during transition between stable positions. Understanding the three-dimensional characteristics of these mechanisms and the effect of eccentric loading conditions would be helpful in design and analysis of FCBMs. Two 3-D FEA models were developed for analysis and ...


Thermal Stability Of Electrodeposited Liga Ni-W Alloys For High Temperature Mems Applications Jan 2008

Thermal Stability Of Electrodeposited Liga Ni-W Alloys For High Temperature Mems Applications

A.S. Md Abdul Haseeb

For thermally stable LIGA materials for high temperature MEMS applications LIGA Ni-W layers and micro testing samples with different compositions (15 and 5 at% W) were electrodeposited. In order to investigate the thermal stability the Ni-W layers were annealed at different temperatures (300-700°C) and for different durations (1, 4, 16 h). Their microstructure and micro-hardness were than analysed after annealing and compared with those of as-deposited states. The observed microstructures show, in comparison to pure LIGA nickel, a small grain growth and a relatively stable structure up to 700°C. The micro-hardness values of the LIGA Ni-W layers are ...