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Mechanical Engineering Commons

Open Access. Powered by Scholars. Published by Universities.®

2008

Industrial and Manufacturing Engineering

Reliability

Articles 1 - 2 of 2

Full-Text Articles in Mechanical Engineering

Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers Nov 2008

Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers

Industrial and Manufacturing Engineering

Mobile and handheld electronic devices are prone to being dropped. This drop event may result in failure of solder joints inside these devices. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD22-B111 to standardize the method of drop testing surface mount electronic components. However, there has been little study on the effects of additional mass on the board and rigidity of the board on drop test reliability. This paper examines the drop impact dynamic responses of the JEDEC JESD22-B111 board. Of interest are the effects of ...


The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham Nov 2008

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequency of 60KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through design of experiment methodology for four different cases: 25.4 μm wire at 60 kHz, 25.4 μm wire at 120 kHz, 17.8 μm wire at 60 kHz, and 17.8 μm wire at 120 kHz. The ...