Mechanical Engineering Commons^™

Numerical Analysis Of The Operation Of A Water Cannon, Teymuraz G. Bitadze

Theses

This study was designed to investigate the operational process of a launcher for generation of high speed water projectiles, and it involved the optimization of the geometry of a launcher body. The objective of the optimization of the internal geometry was to increase the effective momentum of the projectile while the optimization of the external geometry resulted in the reduction of the mass of the launcher.

In the course of the optimization of the internal geometry the exit velocity variation was determined, and used to compute an effective projectile momentum, which actually affects a workpiece. In this research, it was …

Burmester Curve And Numerical Motion Generation Of Grashof Mechanisms With Perimeter And Transmission Angle Optimization In Mathcad, Peter J. Martin

Theses

An infinite number of planar four-bar mechanism solutions exist for a series of prescribed rigid-body positions. Given a set of Burmester curves or numerically-generated fixed and moving pivot curves, sorting through the limitless number of possible mechanism solutions to find one that ensures full link rotatibility, satisfies compactness criteria and produces feasible transmission angles can be a daunting task. In this work, two algorithms are developed and presented by which the user can select optimum planar four-bar motion generators (optimum with respect to Grashof criteria, mechanism perimeter criteria and transmission angle criteria) from a set of all mechanism solutions produced …

Thermo-Mechanical Design Of A 100 Ghz Mmic Power Amplifier Using Flip Chip Technology, Sean Cremin

Theses

This thesis is concerned with the thermo-mechanical design, thermal modelling and temperature profile measurement of a 100 GHz flip chip bump bonded MMIC medium power amplifier.

Flip chip mounting offers superior RF performance in terms of output power, gain, noise figure and bandwidth. The thermal challenge was to dissipate approximately two watts of DC power from the GaAs MMIC (monolithic microwave integrated circuit) through Au (gold) stud bumps which equates to less then 7% of the total surface area of the die. Infrared thermographic images confirmed that the flip chip MMIC amplifier was functional with all eight FET stages on …