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Machining Of Silicon Wafers With An Abrasive Water Jet Cutter, Frank J. Marciniak
Machining Of Silicon Wafers With An Abrasive Water Jet Cutter, Frank J. Marciniak
Theses
This thesis consists of a study of the effects of abrasive water jet cutting on brittle silicon substrates. In total, 26 different cuts were made in a single crystal silicon substrate with an abrasive water jet cutter under different conditions of water flow, water pressure, and abrasive flow rate. These cuts were analyzed for surface roughness, and microstructure.
The roughness measurements were compared in order to determine the best possible cutting conditions. The cut with the best roughness of 0.000170 inches was obtained under cutting conditions of 30 KSI water pressure, 1 inch/minute cutting speed, and an abrasive flow rate …