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Full-Text Articles in Mechanical Engineering
Non-Destructive Evaluation Of Space Shuttle Thermal Protection System Tile Bond Integrity, George David Mulligan
Non-Destructive Evaluation Of Space Shuttle Thermal Protection System Tile Bond Integrity, George David Mulligan
Retrospective Theses and Dissertations
Experimental modal analysis (EMA) is used as a non-destructive technique for the evaluation of Space Shuttle thermal protection system (TPS) tile bond integrity. Finite element (FE) models for tile systems were developed and were used to generate their vibration characteristics (i.e. natural frequencies and mode shapes). Various TPS tile assembly configurations as well as different bond conditions were analyzed. Results of finite element analyses demonstrated a drop in natural frequencies and a change in mode shapes which correlate with both size and location of disband. Results of experimental testing of tile panels correlated with FE results and demonstrated the feasibility …
Microchannel Fluid Flow In A Silicon Chip, Ronald R. Ulseth
Microchannel Fluid Flow In A Silicon Chip, Ronald R. Ulseth
Retrospective Theses and Dissertations
The objective of this study was to analyze theoretically and experimentally the fluid characteristics of forced flow in microchannels. An apparatus was designed and constructed to allow microflow through a 450 μm wide by 17. 5 μm deep microchannel in a silicon chip. The flow through the chip was laminar with Reynolds numbers not exceeding 100. Tuckerman and Pease (1981) theorized that microscopic heat exchangers etched in the back of silicon chips could provide for efficient heat removal from the chips at rates much higher than the conventional methods could attain. The best technologies available provided for heat removal rates …