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Full-Text Articles in Mechanical Engineering

Effects Of Ultrasonic Transducers On Heat Transfer In Packed Particle Beds, David Patrick Moseley Dec 2016

Effects Of Ultrasonic Transducers On Heat Transfer In Packed Particle Beds, David Patrick Moseley

Masters Theses

The objective of this study was to determine the effects of ultrasonic transducers on heat transfer in a packed particle bed heat exchanger. Although substantial research has been devoted to ultrasound, and the associated improvements in heat transfer, data regarding the effects on packed particle beds is non-existent. This is of particular interest given the potential to improve heat transfer in a wide variety of packed particle bed systems. A 42.9% increase in the heat transfer rate was demonstrated as the result of improved fluid convection throughout the packed particle bed. Secondary effects, including acoustic cavitation, acoustic streaming and local …


Characterization Of Heat Transfer Coefficient Uncertainty In Support Of High Temperature Probe Measurement Technology, Marcus S. Conner Dec 2013

Characterization Of Heat Transfer Coefficient Uncertainty In Support Of High Temperature Probe Measurement Technology, Marcus S. Conner

Masters Theses

The development of new materials and processes have enabled defense, industrial, and research devices that operate in high temperature environments. Measurement technology must keep up with the demand of these environments.

The objective of this work is to provide a correlation between the heat transfer coefficient (and Nusselt Number) and the flow Reynolds number (and Prandtl number) for a truncated cylindrical probe. The correlation provides reduced uncertainty for materials whose heat transfer coefficient is not well defined. The configuration for the experiment uses the University of Tennessee Space Institute’s (UTSI) blow down air supply system discharging into a duct and …


Investigation Of The One-Probe And Two-Probe Calibration Integral Equation Methods Using Experimental Data, Abhay Sanjeev Pande Dec 2013

Investigation Of The One-Probe And Two-Probe Calibration Integral Equation Methods Using Experimental Data, Abhay Sanjeev Pande

Masters Theses

This work aims to expand the applicability of the recently devised physics-based Calibration Integral Equation Method (CIEM) at the University of Tennessee Knoxville, for solving the Inverse Heat Conduction Problem (IHCP) as applied to a one-dimensional domain. Contrary to conventional schemes of solving the IHCP, the CIEM does not require the knowledge of the thermo-physical properties of the domain, sensor characterization and sensor probe locations. The pertinent information is implicitly accounted for via an experimental run. The experimental run ‘calibrates’ the physics of the domain and is called the ‘calibration run’. The net surface heat flux during a real ‘unknown’ …


Cross-Flow, Staggered-Tube Heat Exchanger Analysis For High Enthalpy Flows, Gary L. Hammock May 2011

Cross-Flow, Staggered-Tube Heat Exchanger Analysis For High Enthalpy Flows, Gary L. Hammock

Masters Theses

Cross flow heat exchangers are a fairly common apparatus employed throughout many industrial processes. For these types of systems, correlations have been extensively developed. However, there have been no correlations done for very high enthalpy flows as produced by Arnold Engineering Development Center’s (AEDC) H2 facility. The H2 facility uses a direct current electric arc to heat air which is then expanded through a converging-diverging nozzle to impart a supersonic velocity to the air. This high enthalpy, high temperature air must be cooled downstream by the use of a cross flow heat exchanger.

It is of interest to evaluate the …


A Thermal Feasibility Study And Design Of An Air-Cooled Rectangular Wide Band Gap Inverter, Jacob Christopher Faulkner May 2011

A Thermal Feasibility Study And Design Of An Air-Cooled Rectangular Wide Band Gap Inverter, Jacob Christopher Faulkner

Masters Theses

All power electronics consist of solid state devices that generate heat. Managing the temperature of these devices is critical to their performance and reliability. Traditional methods involving liquid-cooling systems are expensive and require additional equipment for operation. Air-cooling systems are less expensive but are typically less effective at cooling the electronic devices. The cooling system that is used depends on the specific application.

Until recently, silicon based devices have been used for the solid-state devices in power electronics. Newly developed silicon-carbide based wide band gap devices operate at maximum temperatures higher than traditional silicon devices. Due to the permissible increase …