Mechanical Engineering Commons^™

Chemical Mechanical Planarization Of Electronic Materials, Fnu Atiquzzaman

USF Tampa Graduate Theses and Dissertations

In the modern semiconductor manufacturing processes, chemical mechanical planarization (CMP) has attained important processing step because of its ability to provide global planarization. CMP is the planarization technique which is used for the removal of excess material, as left over from the previous processing steps. In addition, CMP offers a uniform surface that is essential for subsequent processing steps, especially for the high resolution photolithography processes. In simpler notation, CMP is a process where a chemical reaction enhances in obtaining a planar surface through removal of the mechanical materials from a wafer.

In this study, CMP performance of three electronic …

Interface Engineered Diamond Coatings For Dry Machining Applications, Humberto Arturo Gomez Vega

USF Tampa Graduate Theses and Dissertations

Several studies have been propose to improve the adhesion of diamond films on cemented carbide tool materials, however a systematic study in identifying the role of the factors that affect the final diamond adhesion and the resulting machining performance of the tool under real manufacturing conditions is still unexplored. CVD diamond film's extraordinary qualities bring little benefit if the film fails to adhere sufficiently to the substrate. Inadequate adhesion undermines tool performance and longevity, causing unpredictable behavior under load and possibly leading to unexpected failure of the tool in the production line. This dissertation investigates the effects of different surface …