Mechanical Engineering Commons^™

A Study Of Shock Analysis Using The Finite Element Method Verified With Euler-Bernoulli Beam Theory; Mechanical Effects Due To Pulse Width Variation Of Shock Inputs; And Evaluation Of Shock Response Of A Mixed Flow Fan, David Jonathan Gonzalez Campos

Master's Theses

A Study Of Shock Analysis Using The Finite Element Method Verified With Euler-Bernoulli Beam Theory; Mechanical Effects Due To Pulse Width Variation Of Shock Inputs; And Evaluation Of Shock Response Of A Mixed Flow Fan

David Jonathan González Campos

For many engineers that use finite element analysis or FEA, it is very important to know how to properly model and obtain accurate solutions for complicated loading conditions such as shock loading. Transient acceleration loads, such as shocks, are not as common as static loads. Analyzing these types of problems is less understood, which is the basis for this study. FEA …

The Effect Of Sensor Mass, Sensor Location, And Delamination Location Of Different Composite Structures Under Dynamic Loading, Albert Darien Liu

Master's Theses

This study investigated the effect of sensor mass, sensor location, and delamination location of different composite structures under dynamic loading. The study pertains to research of the use of accelerometers and dynamic response as a cost-effective and reliable method of structural health monitoring in composite structures. The composite structures in this research included carbon fiber plates, carbon fiber-foam sandwich panels, and carbon-fiber honeycomb sandwich panels. The composite structures were manufactured with the use of a Tetrahedron MTP-8 heat press. All work was conducted in the Cal Poly Aerospace Structures/Composites Laboratory. Initial delaminations were placed at several locations along the specimen, …

Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers

Industrial and Manufacturing Engineering

Mobile and handheld electronic devices are prone to being dropped. This drop event may result in failure of solder joints inside these devices. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD22-B111 to standardize the method of drop testing surface mount electronic components. However, there has been little study on the effects of additional mass on the board and rigidity of the board on drop test reliability. This paper examines the drop impact dynamic responses of the JEDEC JESD22-B111 board. Of interest are the effects of …