Mechanical Engineering Commons^™

Measurement Of The Coefficient Of Thermal Expansion Of Superconducting Thin Films Using Powder X-Ray Diffraction, Biju Chandran, R. Calvin Goforth, S. Nasrazadani

Journal of the Arkansas Academy of Science

The High Density Electronics Center (HiDEC) at the University of Arkansas, Fayetteville is developing the technology for High Temperature Superconductor Multi-Chip Modules (HTSC-MCM's). As part of this work, we are looking at the mechanical properties of HTSC materials. An important mechanical property which influences the mechanical integrity of the hybrid MCMis the coefficient of thermal expansion (CTE) of the HTSC films. As a first step in developing a procedure for the determination of the CTE of HTSC materials, the lattice parameters and the CTE of an alpha-alumina substrate have been determined by powder x-ray diffraction technique. An extension of this …