Mechanical Engineering Commons^™

Lead-Free Solder Joint Reliability – State Of The Art And Perspectives, Jianbiao Pan, Jyhwen Wang, David M. Shaddock

Industrial and Manufacturing Engineering

There is an increasing demand in replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concern. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI …

Work Flow Policy And Within-Worker And Between-Workers Variability In Performance, Kenneth Howard Doerr, Tali Freed, Terence R. Mitchell, Chester A. Schriesheim, Xiaohua Zhou

Industrial and Manufacturing Engineering

Work flow policies are shown to induce a change in average between-workers variability (worker heterogeneity) and within-worker variability in performance times. In a laboratory experiment, the authors measured the levels of worker heterogeneity and within-worker variability under an individual performance condition, a work sharing condition, and a fixed assignment condition. The work sharing policy increased the levels of worker heterogeneity and worker variability, whereas the fixed assignment policy decreased them. These effects, along with work flow policy main effects on mean performance times and variability are examined. This article represents an initial step in understanding effects that may be important …

Lean Energy Analysis: Identifying, Discovering And Tracking Energy Savings Potential, J. Kelly Kissock, John Seryak

Mechanical and Aerospace Engineering Faculty Publications

Energy in manufacturing facilities is used for direct production of goods, space conditioning, and general facility support such as lighting. This paper presents a methodology, called lean energy analysis, LEA, for graphically and statistically analyzing plant energy use in terms of these major end uses.

The LEA methodology uses as few as 60 easily obtainable data points. Multivariable change-point models of electricity and natural gas use as functions of outdoor air temperature and production data are developed. The statistical models are used to subdivide plant energy use into facility, space-conditioning and production-related components.

These breakdowns suggest the savings potential from …

Wire Bonding Challenges In Optoelectronics Packaging, Jianbiao Pan, Patrice Fraud

Industrial and Manufacturing Engineering

Wire bonding has been used in integrated circuit (IC) packaging for many years. However, there are many challenges in wire bonding for optoelectronics packaging. These challenges include bonding on sensitive devices, bonding over cavity, bonding over cantilevel leads and bonding temperature limitations. The optoelectronics package design brings another challenge, which requires wire bonding to have deep access capability. In this paper, the wire bonding technologies are reviewed and ball bonding and wedge bonding are compared. The variables that affect the wire bonding process are then discussed. Finally, the challenges of wire bonding in optoelectronics packaging are presented in detail.

Effect Of Chromium-Gold And Titanium-Titanium Nitride-Platinum-Gold Metallization On Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, Jason Baxter

Industrial and Manufacturing Engineering

Gold metallization on wafer substrates for wire/ribbon bond applications require good bond strength to the substrate without weakening the wire/ribbon. This paper compares the ribbon bondability of Cr/Au and Ti/TiN/Pt/Au metallization systems. Both chromium and titanium are used to promote adhesion between substrates and sputtered gold films. Both can diffuse the gold surface after annealing and degrade the wire/ribbon bondability. Restoring bondability by ceric ammonium nitrate (CAN) etch was investigated. Experiments were conducted to investigate the effect of Cr/Au and Ti/TiN/Pt/Au, annealing, and CAN etch processes on 25.4 times; 254 μm (1 × 10 mil) ribbon bonding. All bonds were …

Food Based Approaches For A Healthy Nutrition In Africa, Mamoudou Hama Dicko

Pr. Mamoudou H. DICKO, PhD

The latest estimates of the FAO demonstrate the problems of the fight against hunger. These problems are manifested by the ever-increasing number of chronically undernourished people worldwide. Their numbers during the 1999-2001 period were estimated at about 840 million of which 798 million live in developing countries. Sub-Saharan Africa alone represented 198 million of those. In this part of Africa the prevalence of undernourishment ranges from 5-34%, causing growth retardation and insufficient weight gain among one third of the children under five years of age and resulting in a mortality of 5-15% among these children. Malnutrition resulting from undernourishment is …

Critical Variables Of Solder Paste Stencil Printing For Micro-Bga And Fine-Pitch Qfp, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Stencil printing continues to be the dominant method of solder deposition in high-volume surface-mount assembly. Control of the amount of solder paste deposited is critical in the case of fine-pitch and ultrafine-pitch surface-mount assembly. The process is still not well understood as indicated by the fact that industry reports 52-71% surface-mount technology (SMT) defects are related to the solder paste stencil printing process. The purpose of this paper is to identify the critical variables that influence the volume, area, and height of solder paste deposited. An experiment was conducted to investigate the effects of relevant process parameters on the amount …

A Supply Chain Management Tool For Linking Courses In Manufacturing Engineering , Daniel Waldorf, Sema E. Alptekin

Industrial and Manufacturing Engineering

A Recent Society of Manufacturing Engineers (SME) grant received by Manufacturing Engineering Program at Cal Poly has provided funds to strengthen its curricular focus on supply chain management, flexibility, business skills, quality, and process controls. New courses and laboratories are developed in electronics manufacturing, information technology, and supply chain management. A functioning supply chain environment has been developed to provide vertical integration among several courses. A software tool being developed in-house integrates the activities of the students who play the roles of customers and suppliers. Details of the various components of this comprehensive project are presented in this paper.

Why Toyota And Honda Topped The 2002 J.D. Power Quality Study, Susan Lightle, Kenneth Yale Rosenzweig, John Talbott

Accounting Faculty Publications

Toyota again topped the annual J. D. Power and Associates quality study released in late May of 2002. Toyota scored the highest mark ever with l 07 defects per l 00 vehicles, while Honda came in second with 113 defects. The study was based on responses of approximately 65,000 new car owners queried during their first 90-days of ownership.

These results do not surprise us, as we have been fortunate to make numerous sojourns to the Toyota plant in Georgetown, Kentucky, and observe the manufacturing processes. These trips were normally facilitated by a former Japanese student of ours, Minako Yanke, …

Optimization-Based Architecture For Managing Complex Integrated Product Development Projects, Hisham Mohamed El-Sayed Abdelsalam

Mechanical & Aerospace Engineering Theses & Dissertations

By the mid-1990's, the importance of early introduction of new products to both market share and profitability became fully understood. Thus, reducing product time-to-market became an essential requirement for continuous competition. Integrated Product Development (IPD) is a holistic approach that helps to overcome problems that arise in a complex product development project. IPD emphasis is to provide a framework for an effective planning and managing of engineering projects. Coupled with the fact that about 70% of the life cycle cost of a product is committed at early design phases, the motivation for developing and implementing more effective methodologies for managing …

A Taxonomy Of Scheduling Problems In Semiconductor Device Test Operations, Tali Freed, Robert C. Leachman, Kenneth H. Doerr

Industrial and Manufacturing Engineering

Semiconductor device test facilities differ not only by production volume and tester brands. The complexity of the devices and the characteristics of the testers affect the scheduling methodologies as well. Goals and strategies vary from one firm to another, leading to a variety of objectives and performance measures. Due to random yield lot size is variable and lot priorities are common. Changeover times are oftentimes sequence-dependent. Since semiconductor device testing systems are very costly, scheduling methods that increase the throughput of the facility are financially significant. In this paper we describe a variety of semiconductor device testing environments, develop mathematical …

Generic Cost Estimation Framework For Design And Manufacturing Evaluation, Uday A. Kilkami

Mechanical & Aerospace Engineering Theses & Dissertations

A major drawback of current cost estimation models is their incapability of embracing effectively complete product development stage. Parametric estimation works well in early stages of design, but in detail design stage, a more complete estimation is provided by process model based and detail estimation techniques. A major paradigm shift is proposed in this work whereby ‘Cost’ is to be considered as a design parameter from scientific perspective, and it is to be treated as a design consequence rather than as an operational outcome. A comprehensive framework using System Analysis fundamentals is designed to study ‘Process Cost’ aspects of part …

Computer-Aided Engineering For Tool Design In Manufacturing Engineering Curriculum, Daniel J. Waldorf

Industrial and Manufacturing Engineering

At Cal Poly – San Luis Obispo, a variety of tool design issues are covered in a junior-level manufacturing engineering course called Tool Engineering. In the course, designing fixtures – for any process – is a major component of the content. The process of designing a fixture is similar to the method a mechanical engineer would use to design a new product. The course is therefore an excellent opportunity to teach design principles to manufacturing engineers. This project involves an attempt to introduce computer-aided methods, including the finite element method (FEM), for analysis of tool design into the Tool Engineering …

Teaching Factory, Sema E. Alptekin, Reza Pouraghabagher, Patricia Mcquaid, Daniel Waldorf

Industrial and Manufacturing Engineering

Academia must develop a new approach to teaching in order to better prepare engineering students to function efficiently and adjust readily within the framework of the factories in the real world. Some engineering programs emphasize theory, while others emphasize application as isolated blocks. The "Teaching Factory" being developed at Cal Poly combines both theory and applications. It makes use of state-of-the-art industrial grade production equipment, computer hardware and software in the form of the following two systems: 1) a functioning "real" factory hardware environment, and 2) a Production Planning and Control Center.

Plastic Solder Paste Stencil For Surface Mount Technology, Christopher K. Wong, Daniel Waldorf

Industrial and Manufacturing Engineering

Solder paste masks or stencils are an integral part of the manufacturing process for surface mount PCBs. This study examines the feasibility of a process for rapid creation of a solder paste stencil using thermoplastic material. CNC laser cutting of the stencil geometry is replacing traditional use of chemical etching on metal sheets to produce stencils. Laser cutting has been used to improve process speed, accuracy, and cost. This research attempts to continue to simplify and reduce costs in the stencil making process by proposing as the stencil material a common thermoplastic that can be cut easily and quickly using …

Product Flexibility In Selecting Manufacturing Planning And Control Strategy, Emine Persentili, Sema E. Alptekin

Industrial and Manufacturing Engineering

The manufacturing systems capable of producing several products simultaneously are frequently subject to changes in product types due to demand fluctuations. In such systems a product flexible manufacturing planning and control (MPC) strategy is needed to change from one product type to another with minimum deterioration to system performance levels. The objective of this research is to develop a systematic analysis and evaluation approach in order to compare the MRP-push and JIT-pull strategies quantitatively based on a product flexibility measure. A new product flexibility measure is developed based on the sensitivity to change concept and presented together with the implementation …

An Integrated Engineering-Computation Framework For Collaborative Engineering: An Application In Project Management, Hisham Mohamed El-Sayed Abdelsalam

Mechanical & Aerospace Engineering Theses & Dissertations

Today's engineering applications suffer from a severe integration problem. Engineering, the entire process, consists of a myriad of individual, often complex, tasks. Most computer tools support particular tasks in engineering, but the output of one tool is different from the others'. Thus, the users must re-enter the relevant information in the format required by another tool. Moreover, usually in the development process of a new product/process, several teams of engineers with different backgrounds/responsibilities are involved, for example mechanical engineers, cost estimators, manufacturing engineers, quality engineers, and project manager. Engineers need a tool(s) to share technical and managerial information and to …

Simtrainer: A Management Training Tool, Wade Stark, Sema E. Alptekin

Industrial and Manufacturing Engineering

Abstract published of poster paper presented at conference.

An Evaluation Of Ploughing Models For Orthogonal Machining, Daniel J. Waldorf, Richard E. Devor, Shiv G. Kapoor

Industrial and Manufacturing Engineering

An analytical comparison is made between two basic models of the flow of workpiece material around the edge of an orthogonal cutting tool during steady-state metal removal. Each has been the basis for assumptions in previous studies which attempt to model the machining process, but no direct comparison had been made to determine which, if either, is an appropriate model. One model assumes that a separation point exists on the rounded cutting edge while the other includes a stable build-up adhered to the edge and assumes a separation point at the outer extreme of the build-up. Theories of elastic-plastic deformation …

Scheduling Semiconductor Device Test Operations On Multihead Testers, Tali Freed, Robert C. Leachman

Industrial and Manufacturing Engineering

Past attempts to devise scheduling methods for the device test operations of semiconductor manufacturing firms fail to address a significant characteristic of multiple-head test systems—the dependency of processing rates on the lots processed simultaneously on the testers. Since the problem has never been modeled accurately in the scheduling literature, feasibility and performance of previously proposed scheduling methodologies for multihead testers may not be accurately assessed. In this paper, we describe the multihead tester scheduling problem, present an enumeration solution procedure, and illustrate the problems of previously suggested tester scheduling algorithms.

Gauge Repeatability & Reproducibility Study For A 3-D Solder Paste Inspection System, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Due to the increased use of Ball Grid Arrays (BGAs) and fine pitch and ultra fine pitch Quad Flat Packages (QFPs), there is a dramatic increase in demand for solder paste inspection after the stencil printing process. The important response variables of the printing process are deposited solder paste volume, area, height and position. To identify and remove defects at the earliest possible process step, a 3-D solder paste inspection system should be used to monitor solder paste deposited on all pads on every board before component placement. An example is a fully automatic laser-based 3-D triangulation solder paste inspection …

Critical Variables Of Solder Paste Stencil Printing For Micro-Bga And Fine Pitch Qfp, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Stencil printing continues to be the dominant method of solder deposition in high volume surface mount assembly. Control of the amount of solder paste deposited is critical for fine pitch and ultra-fine pitch SMT assembly. The process is still not well understood as indicated by the fact that industry reports 52-71% of SMT defects are related to the solder paste stencil printing process. The purpose of this paper is to identify the critical variables that influence the deposited solder paste volume, area, and height. An experiment was conducted to investigate the effects of relevant process parameters on the amount of …

Screen Printing Process Design Of Experiments For Fine Line Printing Of Thick Film Ceramic Substrates, Jianbiao Pan, Gregory L. Tonkay, Alejandro Quintero

Industrial and Manufacturing Engineering

Screen printing has been the dominant method of thick film deposition because of its low cost. Many experiments in industry have been done and many models of the printing process have been developed since the 1960's. With a growing need for denser packaging and a drive for higher pin count, screen printing has been refined to yield high resolution prints. However, fine line printing is still considered by industry to be difficult. In order to yield high resolution prints with high first pass yields and manufacturing throughput, the printing process must be controlled stringently.

This paper focuses on investigating the …

Industrial Engineering Made Simple, Deena Daggett, Sema E. Alptekin

Industrial and Manufacturing Engineering

Many high school students these days do not quickly recognize or identify Industrial Engineering (IE) procedures, practices, and products. Recruitment of qualified students into IE programs requires continuous planning, publicizing, and networking. Traditional recruitment efforts have included high school visits, brochures & flyers, and university-sponsored workshops. However, these techniques have only achieved mediocre success. Currently, a need exists for new promotional materials that utilize visual tools and provide a “hands-on” approach. We have developed several exercises that successfully introduce IE. Two such exercises are explained in this paper. The first exercise demonstrates the differences between Assembly line and Cellular Manufacturing …

Phd Thesis (Doctorat De Spécialité): Université De Ouagadougou, 1999. Dr. Mamoudou H. Dicko. Purification Et Propriétés Physico-Chimiques Des Enzymes De Curculigo Pilosa, Gladiolus Klattianus Et Boscia Senegalensis Catalysant L'Hydrolyse Des Polysaccharides (Amidon Et Béta-Glucanes), Mamoudou H. Dicko Prof.

Pr. Mamoudou H. DICKO, PhD

The objective of this study was the research of novel and inexpensive sources of polysaccharides degrading enzymes such as amylases and glucanases from local plants in order to justify their biotechnological applications. The isolation of two l3-amylases and an endo-1,3-ß-D-glucanase was reached using common protein purification methods such as buffer extraction, ammonium sulfate fractionation, ionexchange and gel filtration chromatographies. The methods used were simple and easily reproducible, suggesting the possibilfty of large-scale production. ln the crude extract of Curculigo pilosa tuber, only ß-amylase was detected as starch degrading enzyme and its activity was approximately 282 Uig of fresh material. The …

Graphical Display And Data Structure For Virtual Prototyping, David William Manry

Doctoral Dissertations

One of the goals of engineering firms is to bring better products to market faster. Although concurrent engineering can aid in this endeavor, it requires that all areas of an organization work simultaneously. Thus, current product data must be accessible to everyone.

Virtual prototyping allows this simultaneous exchange of information. Virtual prototyping not only replaces the physical model in product development with a virtual model, but also it goes further by allowing data associated with each part of the model to be accessed. This data is not limited to just geometric properties but could contain other quantifiable properties, such as …

Worn Tool Forces Based On Ploughing Stresses, Daniel Waldorf, Shiv G. Kapoor, Richard E. Devor

Industrial and Manufacturing Engineering

Recent work in modeling of the ploughing mechanism in basic metal machining may provide a means of estimating the additional forces to be expected when cutting with a worn tool. The results predict the rubbing stresses due to the finite radius of an unworn tool edge. Since an unworn tool can be thought of as a worn tool with a wear land width VB = 0, these stresses can make up part of a strategy for predicting the additional forces incurred by a worn tool. This paper develops a wear model by proposing a technique for utilizing the stresses predicted …

Setpoint Tracking Predictive Control In Chemical Processes Based On System Identification, Sinchai Chinvorarat

Mechanical & Aerospace Engineering Theses & Dissertations

A Kraft recovery boiler in a pulp-paper mill provides a means for recovery of the heat energy in spent liquor and recovery of inorganic chemicals while controlling emissions. These processes are carried out in a combined chemical recovery unit and steam boiler that is fired with concentrated black liquor and which produces molten smelt. Since the recovery boiler is considered to be an essential part of the pulp-paper mill in terms of energy resources, the performance of the recovery boiler has to be controlled to achieve the highest efficiency under unexpected disturbances.

This dissertation presents a new approach for combining …

Screen Printing Process Design Of Experiments For Fine Line Printing Of Thick Film Ceramic Substrates, Jianbiao Pan, Gregory L. Tonkay, Alejandro Quintero

Industrial and Manufacturing Engineering

Screen printing has been the dominant method of thick film deposition because of its low cost. Many experiments in industry have been done and many models of the printing process have been developed since the 1960’s. With a growing need for denser packaging and a drive for higher pin count, screen printing has been refined to yield high resolution prints. However, fine line printing is still considered by industry to be difficult. In order to yield high resolution prints with high first pass yields and manufacturing throughput, the printing process must be controlled stringently.

This paper focuses on investigating the …

A Slip-Line Field For Ploughing During Orthogonal Cutting, Daniel J. Waldorf, Richard E. Devor, Shiv. G. Kapoor

Industrial and Manufacturing Engineering

Under normal machining conditions, the cutting forces are primarily due to the bulk shearing of the workpiece material in a narrow zone called the shear zone. However, under finishing conditions, when the uncut chip thickness is of the order of the cutting edge radius, a ploughing component of the forces becomes significant as compared to the shear forces. Predicting forces under these conditions requires an estimate of ploughing. A slip-line field is developed to model the ploughing components of the cutting force. The field is based on other slip-line fields developed for a rigid wedge sliding on a half-space and …