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Electronic Devices and Semiconductor Manufacturing Commons™
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- Articles (3)
- Piezoresistance (3)
- Resistors (3)
- Testing (3)
- Capacitive sensors (2)
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- Design methodology (2)
- Design optimization (2)
- Hybrid power systems (2)
- Insulation (2)
- Nonhomogeneous media (2)
- Predictive models (2)
- Conductivity (1)
- Electric variables (1)
- Piezoresistive devices (1)
- Scanning electron microscopy (1)
- Sensor phenomena and characterization (1)
- Thick film sensors (1)
- Thickness measurement (1)
Articles 1 - 4 of 4
Full-Text Articles in Electronic Devices and Semiconductor Manufacturing
A New Capacitive Test Structure For Microwave Characterization Of Biopolymers, Carrie M. Bartsch, Guru Subramanyam, James Grote, Frank K. Hopkins, Lawrence L. Brott, Rajesh R. Naik
A New Capacitive Test Structure For Microwave Characterization Of Biopolymers, Carrie M. Bartsch, Guru Subramanyam, James Grote, Frank K. Hopkins, Lawrence L. Brott, Rajesh R. Naik
Guru Subramanyam
A new capacitive test structure, containing a parallel plate capacitor with coplanar waveguide feed lines, was used for microwave characterization of biopolymers for the first time. Microwave dielectric properties were obtained for the biopolymers as a function of dc bias and temperature by performing on-wafer microwave measurements. Dielectric tunability was observed with applied dc bias in the biopolymers tested.
Evaluation And Design Optimization Of Piezoresistive Gauge Factor Of Thick-Film Resistors, Sherra E. Kerns, David V. Kerns, C Song, J. L. Davidson, W. P. Kang
Evaluation And Design Optimization Of Piezoresistive Gauge Factor Of Thick-Film Resistors, Sherra E. Kerns, David V. Kerns, C Song, J. L. Davidson, W. P. Kang
Sherra E. Kerns
On the basis of the analysis of all the thick- film design methodologies, the authors designed a test sample on which four different length-over-width ratios of resistors were designed. They found that the length-over-width ratio will substantially affect the gauge factor in some cases, in contrast to prior research. This can be modeled to generate a linear predictive model, The sensors designed on the insulator and the sensors underneath the insulator were also studied in order to simulate the multilayer hybrid technology and study the effects of insulator-resistor-substrate surface interaction. It is demonstrated that design techniques can affect the strain …
Measurement Of Metal Migration On Thick Film Piezoresistors And Their Termination, David V. Kerns, C Song, J L. Davidson, D L. Kinser
Measurement Of Metal Migration On Thick Film Piezoresistors And Their Termination, David V. Kerns, C Song, J L. Davidson, D L. Kinser
David V. Kerns
Metal migration from the thick-film termination can affect not only the electrical characteristics but also the gauge factor or piezoresistive coefficient of thick-film sensors. Four sets of sensors with different ratios were designed to test the influence of the terminal metal migration effects on the gauge factors and resistivity of thick-film resistors. In all the cases, the shortest resistors have a lower gauge factor and a large deviation ofresistances. The longer resistors will have better electrical parameters. SEM (scanning electron microscope) studies showed this interaction at the interface between the terminal and the resistor. The same distance of terminal diffusion …
Evaluation And Design Optimization Of Piezoresistive Gauge Factor Of Thick-Film Resistors, Sherra E. Kerns, David V. Kerns, C Song, J. L. Davidson, W. P. Kang
Evaluation And Design Optimization Of Piezoresistive Gauge Factor Of Thick-Film Resistors, Sherra E. Kerns, David V. Kerns, C Song, J. L. Davidson, W. P. Kang
David V. Kerns
On the basis of the analysis of all the thick- film design methodologies, the authors designed a test sample on which four different length-over-width ratios of resistors were designed. They found that the length-over-width ratio will substantially affect the gauge factor in some cases, in contrast to prior research. This can be modeled to generate a linear predictive model, The sensors designed on the insulator and the sensors underneath the insulator were also studied in order to simulate the multilayer hybrid technology and study the effects of insulator-resistor-substrate surface interaction. It is demonstrated that design techniques can affect the strain …