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Chapman University

Computer and Systems Architecture

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Full-Text Articles in Other Computer Engineering

Investigating On Through Glass Via Based Rf Passives For 3-D Integration, Libo Qian, Jifei Sang, Yinshui Xia, Jian Wang, Peiyi Zhao Jun 2018

Investigating On Through Glass Via Based Rf Passives For 3-D Integration, Libo Qian, Jifei Sang, Yinshui Xia, Jian Wang, Peiyi Zhao

Mathematics, Physics, and Computer Science Faculty Articles and Research

Due to low dielectric loss and low cost, glass is developed as a promising material for advanced interposers in 2.5-D and 3-D integration. In this paper, through glass vias (TGVs) are used to implement inductors for minimal footprint and large quality factor. Based on the proposed physical structure, the impact of various process and design parameters on the electrical characteristics of TGV inductors is investigated with 3-D electromagnetic simulator HFSS. It is observed that TGV inductors have identical inductance and larger quality factor in comparison with their through silicon via counterparts. Using TGV inductors and parallel plate capacitors, a ...