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Full-Text Articles in Chemical Engineering
Method Of Destroying Hazardous Organic Compounds, Dibakar Bhattacharyya, Susan Mawhinney
Method Of Destroying Hazardous Organic Compounds, Dibakar Bhattacharyya, Susan Mawhinney
Chemical and Materials Engineering Faculty Patents
The present invention relates to a method of destroying hazardous vapor phase or aqueous phase organic compound(s) by providing a polymeric siloxane based solvent in a vessel and adding the hazardous organic compound(s) and ozone to the solvent. The solvent may also comprise a mixture of polymeric siloxane based solvent and fluorinated hydrocarbon solvent.
Development Of A Curved Layer Lom Process For Monolithic Ceramics And Ceramic Matrix Composites, Donald A. Klosterman, Richard P. Chartoff, Nora R. Osborne, George A. Graves, Allan Lightman, Gyoowan Han, Akos Bezewredi, Stan Rodrigues, Sung Pak, Gary Kalmanovich, Leon Dodin, Song Tu
Development Of A Curved Layer Lom Process For Monolithic Ceramics And Ceramic Matrix Composites, Donald A. Klosterman, Richard P. Chartoff, Nora R. Osborne, George A. Graves, Allan Lightman, Gyoowan Han, Akos Bezewredi, Stan Rodrigues, Sung Pak, Gary Kalmanovich, Leon Dodin, Song Tu
Chemical and Materials Engineering Faculty Publications
A novel rapid prototyping technology incorporating a curved layer building style was developed. The new process, based on Laminated Object Manufacturing (LOM), was designed for efficient fabrication of curved layer structures made from ceramics and fiber reinforced composites. A new LOM machine was created, referred to as Curved Layer LOM. This new machine uses ceramic tapes and fiber prepregs as feedstocks and fabricates curved structures on a curved-layer by curved-layer basis. The output of the process is a three dimensional "green" ceramic that is capable of being processed to a seamless, fully dense ceramic using traditional techniques. A detailed description …
Copper Alloy-Impregnated Carbon-Carbon Hybrid Composites For Electronic Packaging Applications, S. K. Datta, Surendra N. Tewari, Jorge E. Gatica, W. Shih, L. Bentsen
Copper Alloy-Impregnated Carbon-Carbon Hybrid Composites For Electronic Packaging Applications, S. K. Datta, Surendra N. Tewari, Jorge E. Gatica, W. Shih, L. Bentsen
Chemical & Biomedical Engineering Faculty Publications
Porous carbon-carbon preforms, based on three-dimensional networks of PAN (Polyacrylonitrile)-based carbon fibers and various volume fractions of chemical vapor-deposited (CVD) carbon, were impregnated by oxygen-free, high-conductivity (OFHC) Cu, Cu-6Si-0.9Cr, and Cu-0.3Si-0.3Cr (wt pct) alloys by pressure infiltration casting. The obtained composites were characterized for their coefficient of thermal expansion (CTE) and thermal conductivity (K) along the through-thickness and two in-plane directions. One composite, with a 28 vol pct Cu-0.3Si-0.3Cr alloy, showed outstanding potential for thermal management applications in electronic applications. This composite exhibited approximately isotropic thermal expansion properties (CTE = 4 to 6.5 ppm/K) and thermal conductivities (k greater than …