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Retaining Ring Material Wear Analysis And Testing, Thomas Headland, Barten Hansen, Austin Fisher, Kevin Hurtado

Mechanical Engineering

The chemical mechanical planarization (CMP) of wafers for integrated circuits is an essential – yet expensive – step in their manufacture. CMP machine down-time due to the replacement of process consumables, such as wafer retaining rings, is a significant contributor to the process cost. To reduce the operational cost of their CMP machines, Revasum is interested in exploring new designs and materials for wafer retaining rings to increase their operational lifetime. Background research showed that there is currently no suitable method for testing new retaining ring designs and materials for wear characteristics specific to the CMP process. Available wear testing …