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In Situ Mechanical Characterization Of The Mixed- Mode Fracture Strength Of The Cu/Si Interface For Tsv Structures, Chenglin Wu, Congjie Wei, Yanxiao Li
In Situ Mechanical Characterization Of The Mixed- Mode Fracture Strength Of The Cu/Si Interface For Tsv Structures, Chenglin Wu, Congjie Wei, Yanxiao Li
Civil, Architectural and Environmental Engineering Faculty Research & Creative Works
In situ nanoindentation experiments have been widely adopted to characterize material behaviors of microelectronic devices. This work introduces the latest developments of nanoindentation experiments in the characterization of nonlinear material properties of 3D integrated microelectronic devices using the through-silicon via (TSV) technique. The elastic, plastic, and interfacial fracture behavior of the copper via and matrix via interface were characterized using small-scale specimens prepared with a focused ion beam (FIB) and nanoindentation experiments. A brittle interfacial fracture was found at the Cu/Si interface under mixed-mode loading with a phase angle ranging from 16.7° to 83.7°. The mixed-mode fracture strengths were extracted …