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Full-Text Articles in Engineering

Instrumentation, Modeling, And Sound Metamodeling Foundations For Complex Hybrid Systems, Natasha Amelia Jarus Jan 2021

Instrumentation, Modeling, And Sound Metamodeling Foundations For Complex Hybrid Systems, Natasha Amelia Jarus

Doctoral Dissertations

Many of our critical infrastructures, from power grids to water distribution networks, are complex hybrid systems that use software to control their non-trivial physical dynamics. These systems must be able to capably serve their purpose, while also being reliable, dependable, safe, secure, and efficient. Representation and analysis of these features requires the creation of several distinct models. These models may encode design goals or be derived from collected instrumentation data, reflecting both how a system ought to operate and how it does operate. It is essential to ensure that all of these models consistently and accurately describe the same system. …


System Efficient Esd Design Concept For Soft Failures, Giorgi Maghlakelidze Jan 2020

System Efficient Esd Design Concept For Soft Failures, Giorgi Maghlakelidze

Doctoral Dissertations

"This research covers the topic of developing a systematic methodology of studying electrostatic discharge (ESD)-induced soft failures. ESD-induced soft failures (SF) are non-destructive disruptions of the functionality of an electronic system. The soft failure robustness of a USB3 Gen 1 interface is investigated, modeled, and improved. The injection is performed directly using transmission line pulser (TLP) with varying: pulse width, amplitude, polarity. Characterization provides data for failure thresholds and a SPICE circuit model that describes the transient voltage and current at the victim. Using the injected current, the likelihood of a SF is predicted. ESD protection by transient voltage suppressor …


Characterization And Modeling Of Esd Events And Near-Field Scanning Calibration Structures, Shubhankar Kashinath Marathe Jan 2019

Characterization And Modeling Of Esd Events And Near-Field Scanning Calibration Structures, Shubhankar Kashinath Marathe

Doctoral Dissertations

"This research is divided into three papers that cover, two major topics. The first topic, system-level electrostatic discharge (ESD), is discussed over the course of two papers. The second topic, a calibration structure for near-field scanning probe calibration application, is discussed in the last paper. In the first paper, software-assisted detection methods are proposed for secondary ESD discharges. The measured waveforms are analyzed with respect to waveform parameters, such as the vertical threshold of the rising edge, the derivative of the current waveform, and total charge delivered. These parameters enable automatic detection of secondary ESD while monitoring the discharge waveform …


Methodology For 3d Full-Wave Simulation Of Electrostatic Breakdown Across An Air Gap, Darwin Zhang Li Jan 2018

Methodology For 3d Full-Wave Simulation Of Electrostatic Breakdown Across An Air Gap, Darwin Zhang Li

Masters Theses

"The Rompe-Weizel SPICE model is used to obtain the time dependent arc resistance during simulation of air gap discharge. The SPICE model is solved using a circuit simulator, and the accompanying 3D model is solved using the transmission-line matrix time domain numerical method. Transient co-simulation is a new technique that is used to solve both circuit and 3D models at the same time. Transient co-simulation with the Rompe-Weizel SPICE model is first validated for different arc lengths using a simple geometry of a rod discharging to a ground plane. Validation is achieved by comparing the discharge currents from simulation with …


On-Die Transient Event Sensors And System-Level Esd Testing, Abhishek Patnaik Jan 2018

On-Die Transient Event Sensors And System-Level Esd Testing, Abhishek Patnaik

Doctoral Dissertations

"System level electrostatic discharge (ESD) testing of electronic products is a critical part of product certification. Test methods were investigated to develop system level ESD simulation models to predict soft-failures in a system with multiple sensors. These methods rely completely on measurements. The model developed was valid only for the linear operation range of devices within the system. These methods were applied to a commercial product and used to rapidly determine when a soft failure would occur. Attaching cables and probes to determine stress voltages and currents within a system, as in the previous study, is time-consuming and can alter …


Characterization Of An Integrated Circuit With Respect To Electrostatic Discharge-Induced Soft Failures, Benjamin J. Orr Jan 2016

Characterization Of An Integrated Circuit With Respect To Electrostatic Discharge-Induced Soft Failures, Benjamin J. Orr

Doctoral Dissertations

"This research proposal presents a methodology whereby an integrated circuit (IC) can be characterized with respect to soft-failures induced by Electrostatic Discharge (ESD)-like events. This methodology uses an exclusively "black-box" approach to determine the response of an IC in a system-level environment, thereby allowing it to be implemented without intimate knowledge of the DUT IC. Results from this methodology can be referenced during system design to raise awareness of specific vulnerabilities of the core system ICs.

During work on this methodology, several sub topics have been explored and developed in the field of system-level ESD. Sections 2 and 3 introduce …


On-Die Sensors For Transient Events, Mihir Vimal Suchak Jan 2015

On-Die Sensors For Transient Events, Mihir Vimal Suchak

Masters Theses

"Failures caused by transient electromagnetic events like Electrostatic Discharge (ESD) are a major concern for embedded systems. The component often failing is an integrated circuit (IC). Determining which IC is affected in a multi-device system is a challenging task. Debugging errors often requires sophisticated lab setups which require intentionally disturbing and probing various parts of the system which might not be easily accessible. Opening the system and adding probes may change its response to the transient event, which further compounds the problem.

On-die transient event sensors were developed that require relatively little area on die, making them inexpensive, they consume …