Engineering Commons^™

Experimental And Computational Study On Fracture Mechanics Of Multilayered Structures, Hai Thanh Tran

USF Tampa Graduate Theses and Dissertations

Many devices in electronics are in the form of multilayered structures. These structures can fail catastrophically if they contain defects or cracks. Enhancing their fracture properties is therefore critical to improve the reliability of the systems. The interface-dominated fracture mechanics of multilayered structure was studied using experiments and finite element (FE) modeling by considering two examples: thin films on polymer substrates in flexible electronics and Cu leadframe/epoxy molding compound (EMC) in micro-electronics packaging.

In the first example, aluminum-manganese (Al-Mn) thin films with Mn concentration up to 20.5 at.% were deposited on polyimide (PI) substrates. A variety of phases, including supersaturated …

A Hybrid Finite Element-Finite Difference Method For Thermal Analysis In A Double-Layered Thin Film, Teng Zhu

Doctoral Dissertations

Thin film technology is of vital importance in microtechnology applications. For instance, thin films of metals, of dielectrics such as SiO2, or Si semiconductors are important components of microelectronic devices. The reduction of the device size to the microscale has the advantage of enhancing the switching speed of the device. The reduction, on the other hand, increases the rate of heat generation that leads to a high thermal load on the microdevice. Heat transfer at the microscale with an ultrafast pulsed-laser is also a very important process for thin films. Hence, studying the thermal behavior of thin films or of …