Engineering Commons^™

Stress Analysis Of Embedded Devices Under Thermal Cycling, Sadhana Radhakrishnan

Dissertations and Theses

Embedded active and passive devices has been increasingly used by in order to integrate more functions inside the same or smaller size device and to meet the need for better electrical performance of the component assemblies.

Solder joints have been used in the electronic industry as both structural and electrical interconnections between electronic packages and printed circuit boards (PCB). When solder joints are under thermal cyclic loading, mismatch in coefficients of thermal expansion (CTE) between the printed circuit boards and the solder balls creates thermal strains and stresses on the joints, which may finally result in cracking. Consequently, the mechanical …

Finite Element Analysis Of Thermal Stresses In Semiconductor Devices, Joachim Karl Wilhelm Duerr

Dissertations and Theses

The failure of integrated circuit due to Silicon fracture is one of the problems associated with the production of a semiconductor device. The thermal stresses, which result in die cracking, are for the most part induced during the cooling process after attaching the die with Gold-Silicon solder. Major factors for stress generation in material systems are commonly large temperature gradients and substantial difference in coefficients of thermal expansion.