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Solid State Pre-Formed Electronics Adhesive (Spea), Alexander Randon Cope
Solid State Pre-Formed Electronics Adhesive (Spea), Alexander Randon Cope
Dissertations and Theses
In mobile and handheld consumer electronic markets, product use conditions drive the requirement for mechanical strength and device durability. The majority of relatively large form factor electronic components in a laptop, mobile internet device, PDA, or mobile phone use an adhesive as a stiffener to help protect the component from physical stresses imposed by daily wear and tear. Described herein is an innovative solution referred to as Solid State Pre-Formed Electronics Adhesive (SPEA), which enables a decrease in circuit board manufacturing throughput time while increasing mechanical durability with a consistent and characterized adhesive application process.
Today, many consumer electronic ODM's …