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Copper Electrodeposition Under The Perturbation Of Hard Particles, Zeng-Wei Zhu, Di Zhu
Copper Electrodeposition Under The Perturbation Of Hard Particles, Zeng-Wei Zhu, Di Zhu
Journal of Electrochemistry
Copper electrodepositon was carried out on the rotating cathode,with hard particles(such as ceramic beads) filling between the electrodes.The rotation of cathode led hard particles to polish and impact the surface of deposit during electrodeposition.Copper deposits with a mass of cuspidal nodules were produced in acid sulfate solutions while brittle deposits without nodules were produced in alkaline sulfate solutions.It was also found that brightening and smoothing deposit could be obtained from the alkaline solution,and the deposit was approximatively disordered orientation with granular morphology of about 100~300 nm.The results show that the polishing and impact of hard particles can effectively disturb the …
A Conjugate Dissolution / Deposition Behavior In Thin Layer Electrodeposition, Sun Bin
A Conjugate Dissolution / Deposition Behavior In Thin Layer Electrodeposition, Sun Bin
Journal of Electrochemistry
During the electrodeposition of lead, the dendrite deposit segregates from the cathode due to the disturbance of hydrogen gas. The segregated deposit could move toward the anode spontaneously rather than keep stationary. The studies show that this novel phenomenon was caused by the conjugate electrodissolution and electrodeposition reactions taking place at two ends of the isolated segment of the deposit. The mechanism inducing this phenomenon is suggested.