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Reliability Analysis Of Low-Silver Bga Solder Joints Using Four Failure Criteria, Erin A. Kimura
Reliability Analysis Of Low-Silver Bga Solder Joints Using Four Failure Criteria, Erin A. Kimura
Master's Theses
The appropriate selection of failure criterion for solder joint studies is necessary to correctly estimate reliability life. The objective of this study is to compare the effect of different failure criteria on the reliability life estimation. The four failure criteria in this study are a 20% resistance increase defined in the IPC-9701A standard, a resistance beyond 500 Ω, an infinite resistance (hard open), and a failure criterion based on X-bar and R control charts. Accelerated thermal cycling conditions of a low-silver BGA study included 0°C to 100 °C with ten minute dwell times and -40°C to 125°C with ten minute …
A Study Of Solder Joint Failure Criteria, Jianbiao Pan, Julie Silk
A Study Of Solder Joint Failure Criteria, Jianbiao Pan, Julie Silk
Industrial and Manufacturing Engineering
One of the challenges in an experimental study of solder joint reliability is to determine when cracks occur in a solder joint or when a solder joint fails. Cracks in a real solder joint are difficult to identify using an X-Ray system. Cross-sectioning and scanning electron microscopy (SEM) is a destructive method. A common non-destructive test method is to monitor resistance increase in a solder joint or a daisy-chain. However, no scientific research has been done in establishing the relationship between the crack area of an interconnection and the change in resistance of the interconnection. This paper proposes a method …