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Packaging Of Active Rf Beamforming Ic Utilizing Additive Manufacturing, Ryan Murphy
Packaging Of Active Rf Beamforming Ic Utilizing Additive Manufacturing, Ryan Murphy
USF Tampa Graduate Theses and Dissertations
Packaging of an RF Beamforming IC was performed using an additive manufacturingplatform with FDM, microdispensing, laser subtractive manufacturing, and milling. The beamforming IC was embedded within a multilayer device structure in order to feed a 2x2 antenna sub-array in a compact and completely integrated package. Additive manufacturing allows for simple variation in material parameters and properties that enhances the ability to develop integrated system packaging. This study builds on previous investigations and demonstrates the ability to embed an active RF device with measurable gain within a printed plastic substrate. Critical to developing a repeatable method for this packaging solution, initial …