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2001

California Polytechnic State University, San Luis Obispo

Materials Science and Engineering

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Evaluation Of A Threshold-Based Model Of The Elevated-Temperature Fatique Of Impact-Damaged Γ-Tial, Trevor S. Harding, J. Wayne Jones Dec 2001

Evaluation Of A Threshold-Based Model Of The Elevated-Temperature Fatique Of Impact-Damaged Γ-Tial, Trevor S. Harding, J. Wayne Jones

Materials Engineering

Step-loading fatigue tests have been conducted on two γ-TiAl alloys with differing microstructures following quasi-static indentations intended to simulate assembly-related impact damage to low-pressure turbine blades. Fatigue tests were conducted at 600 °C using computer-controlled servohydraulic loading at a frequency of 20 Hz. Reasonably good agreement was achieved between the fatigue data and calculated fatigue strength based on the fatigue threshold and measured impact severity. In certain cases, the fatigue threshold model fails to completely describe the data. These discrepancies may be related to residual stresses, variations in crack-shape morphology, and small-crack effects. Residual stresses could not be directly measured, …


The Current State Of Research On Academic Dishonesty Among Engineering Students, Trevor S. Harding, Donald D. Carpenter, Susan M. Montgomery, Nicholas H. Steneck Oct 2001

The Current State Of Research On Academic Dishonesty Among Engineering Students, Trevor S. Harding, Donald D. Carpenter, Susan M. Montgomery, Nicholas H. Steneck

Materials Engineering

Academic dishonesty, or cheating, has become a serious problem at colleges and universities. This is particularly true of engineering students who, are among the most likely to cheat in college. The present paper reviews the literature as a basis of broadly understanding academic dishonesty. This discussion focuses on three primary issues: (1) perceptions of and attitudes towards cheating, (2) reasons for student cheating, and (3) methods of promoting academic integrity. A current research project being developed by the authors is also discussed. The premise of this research is that students are constantly making ethical judgements between the pressure to cheat …


Hfco2 Laves Phase Intermetallics - Part Ii: Elastic And Mechanical Properties As A Function Of Composition, Katherine C. Chen, Fuming Chu, Paul G. Kotula, Dan Thoma Sep 2001

Hfco2 Laves Phase Intermetallics - Part Ii: Elastic And Mechanical Properties As A Function Of Composition, Katherine C. Chen, Fuming Chu, Paul G. Kotula, Dan Thoma

Materials Engineering

In efforts to establish and understand structure–property relationships in Laves phase intermetallics, elastic and mechanical properties are studied as a function of composition in the C15 HfCo2 system. Elastic constants and Debye temperatures are determined by resonant ultrasound spectroscopy (RUS) at room temperature. A maximum near the stoichiometric Laves composition is revealed with the Young's modulus, bulk modulus, and Poisson's ratio. In addition, a slight drop in shear modulus is found with Co-rich compositions, and the Debye temperature increases with Co-content. Room temperature Vickers indentation is performed to assess the microhardness and fracture toughness of the HfCo2 alloys. …


Hfco2 Laves Phas Intermetallics - Part I: Solubility Limits And Defect Mechanisms, Katherine C. Chen, Eric J. Peterson, Dan J. Thoma Sep 2001

Hfco2 Laves Phas Intermetallics - Part I: Solubility Limits And Defect Mechanisms, Katherine C. Chen, Eric J. Peterson, Dan J. Thoma

Materials Engineering

Solubility limits and constitutional defects in Laves phase intermetallics are investigated with the C15 HfCo2 system. Several binary alloy compositions based on HfCo2 are characterized by optical and scanning electron microscopy (SEM), electron microprobe analysis (EPMA), X-ray diffraction (XRD), and density measurements. Rietveld refinements of XRD scans are used to determine lattice constants, anisotropic strain parameters, and atomic occupancies. Compositional trends are compared against predicted or calculated trends due to an anti-site substitution or vacancy defect mechanism. Geometric models and atomic size factors are used to establish solubility limits and to give insight into defect mechanisms. Results from …


The Foundation Series On Corrosion: Integrating Science, Math, Engineering & Technology In A Lab Setting, Linda Vanasupa, Heather Smith, Blair London, Katherine C. Chen, David Niebuhr, Lanny Griffin, Jeff Jones Jun 2001

The Foundation Series On Corrosion: Integrating Science, Math, Engineering & Technology In A Lab Setting, Linda Vanasupa, Heather Smith, Blair London, Katherine C. Chen, David Niebuhr, Lanny Griffin, Jeff Jones

Materials Engineering

We have developed a laboratory module focusing on the subject of corrosion. The module itself is designed to be completed in one three-hour session. It consists of three parts: I. The Impact of Corrosion Media, II. The Impact of Corroding Materials, III. The Impact of Anode/Cathode Sizes. Our objectives in developing this module were to address the need for clear bridges between math, science and technology in the engineering curriculum and to provide a means of faculty development primarily at community colleges. As a result, it was designed to allow the engineering student to experience the synergy of science, math …


Asee Student Chapters: From Student Members To Faculty, Jennifer Kadlowec, Kurt Degoede, Trevor S. Harding, Christian Lorenz Jun 2001

Asee Student Chapters: From Student Members To Faculty, Jennifer Kadlowec, Kurt Degoede, Trevor S. Harding, Christian Lorenz

Materials Engineering

The University of Michigan Student Chapter of the American Society for Engineering Education has grown from a small core group of founding members, who organized panel discussions for the graduate student community, into a flourishing student organization, which continues to grow in membership and events. The purpose of this paper is to promote graduate student chapters of the ASEE and demonstrate the positive impact that student member participation has had, particularly for those who have recently entered academia. Many events and activities of the University of Michigan Student Chapter of the American Society for Engineering Education (UM-ASEE Student Chapter) will …


Useful Approaches To Preventing Academic Dishonesty In The Classroom, Trevor S. Harding Jun 2001

Useful Approaches To Preventing Academic Dishonesty In The Classroom, Trevor S. Harding

Materials Engineering

Over the past three decades, academic dishonesty (a.k.a. cheating) has become an increasingly common occurrence among college-aged students, and engineering students are known to be among the most frequent culprits. At most universities, cheating is dealt with after the fact. Few institutions go beyond drafting an academic integrity policy to prevent cheating before it happens. The same situation exists in the classroom. The majority of college professors report doing little or nothing to reduce the frequency of cheating in their classes, usually because of a lack of awareness of its occurrence. And when cheating is observed, faculty overwhelmingly choose to …


On The Frequency And Causes Of Academic Dishonesty Among Engineering Students, Trevor S. Harding Jun 2001

On The Frequency And Causes Of Academic Dishonesty Among Engineering Students, Trevor S. Harding

Materials Engineering

According to studies of self-reported academic dishonesty conducted over time, cheating among college students has been on the increase since at least the 1940’s. This is especially true for engineering students who are now among the most likely to cheat compared to other disciplines. This paper will present a synopsis of the literature on academic dishonesty. In addition, the results of a pilot study on cheating among engineering students conducted at a small mid-western private engineering school are described. Engineering students in an introductory engineering materials course were asked to complete a survey on their perceptions of cheating; therefore, all …


Plasma Deposition Of Spin Chucks To Reduce Contamination Of Silicon Wafers, Richard N. Savage, Emir Gurer, Ed C. Lee Jun 2001

Plasma Deposition Of Spin Chucks To Reduce Contamination Of Silicon Wafers, Richard N. Savage, Emir Gurer, Ed C. Lee

Materials Engineering

An apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.


Heat Treatment Of Gamma Titanium Aluminide Alloys, Thomas J. Kelly, Michael J. Weimer, Curtiss M. Austin, Blair London, Donald E. Larson Jr., Dean A. Wheeler May 2001

Heat Treatment Of Gamma Titanium Aluminide Alloys, Thomas J. Kelly, Michael J. Weimer, Curtiss M. Austin, Blair London, Donald E. Larson Jr., Dean A. Wheeler

Materials Engineering

A gamma titanium aluminide alloy article, is prepared using a piece of a gamma titanium aluminide alloy having a composition capable of forming alpha, alpha-2, and gamma phases. The alpha transus temperature of the gamma titanium aluminide alloy piece is determined. The gamma titanium aluminide alloy piece is consolidated by hot isostatic pressing at a temperature of from about 50 F. to about 250 F. below the alpha transus temperature and at a pressure of from about 10,000 to about 30,000 pounds per square inch, for a duration of from about 1 to about 20 hours. The piece is heat …


Method And Apparatus For Adaptive Process Control Of Critical Dimensions During Spin Coating Process, Richard N. Savage, Emir Gurer Jan 2001

Method And Apparatus For Adaptive Process Control Of Critical Dimensions During Spin Coating Process, Richard N. Savage, Emir Gurer

Materials Engineering

A spin coating process for controlling the mean thickness of photoresist on the surface of a semiconductor wafer. The wafer surface has a central axis normal to the surface. The process comprises the steps of applying the solution to the wafer surface and spinning the wafer about the central axis at a spindle speed until the solution has dried. The spindle speed is a function of the desired mean thickness of the photoresist, the barometric pressure and the relative humidity. The spindle speed is determined from a statistical model described by the equation: MT=A+BxRH+CxBP+D/SS1/2 wherein: MT is mean thickness …