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Open Access. Powered by Scholars. Published by Universities.®

2008

Missouri University of Science and Technology

Electromagnetic Compatibility

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Characterization Of Serial Links At 5.5gbps On Fr4 Backplanes, Vittorio Ricchiuti, Antonio Orlandi, James L. Drewniak, Francesco De Paulis Sep 2008

Characterization Of Serial Links At 5.5gbps On Fr4 Backplanes, Vittorio Ricchiuti, Antonio Orlandi, James L. Drewniak, Francesco De Paulis

Electrical and Computer Engineering Faculty Research & Creative Works

Nowdays the fast and increased demand for bandwidth in the telecommunication world translates into the design of complex boards exchanging data at high bit rate in reduced design cycle. Sometimes it is impossible to spent time in setting pre-layout simulations, because they are not compatible with the design time schedule. In this scenario it is better to design the boards using experience and then make simulations in conjunction with measurements, using customized numerical tools which don't need complex models.


Efficient Prediction Of Rf Interference In A Shielding Enclosure With Pcbs Using A General Segmentation Method, Yaojiang Zhang, Xiaopeng Dong, Zhenwei Yu, Francesco De Paulis, Gang Feng, Jason A. Mix, Daniel Hua, Kevin P. Slattery, James L. Drewniak, Jun Fan Sep 2008

Efficient Prediction Of Rf Interference In A Shielding Enclosure With Pcbs Using A General Segmentation Method, Yaojiang Zhang, Xiaopeng Dong, Zhenwei Yu, Francesco De Paulis, Gang Feng, Jason A. Mix, Daniel Hua, Kevin P. Slattery, James L. Drewniak, Jun Fan

Electrical and Computer Engineering Faculty Research & Creative Works

Cavity model with segmentation method is extended to the analysis of radio frequency interference (RFI) problems in a shielding enclosure with printed circuit boards (PCBs) . Sixteen different Green's functions, instead of one in the conventional segmentation method developed for PCB cavities, are introduced to describe the fields in various cavities formed by enclosure walls and PCB copper planes. Both horizontal and vertical connections among these cavities are achieved by enforcing the boundary conditions along their common interfaces. Numerical examples demonstrate the efficiency and accuracy of the method by compared with full wave simulations.


Automated Near-Field Scanning To Identify Resonances, Giorgi Muchaidze, Huang Wei, Jin Min, Shao Peng, James L. Drewniak, David Pommerenke Sep 2008

Automated Near-Field Scanning To Identify Resonances, Giorgi Muchaidze, Huang Wei, Jin Min, Shao Peng, James L. Drewniak, David Pommerenke

Electrical and Computer Engineering Faculty Research & Creative Works

Near-field scanning systems are a tool for rootcause ESD, EMI, and immunity analysis of electronic systems, as well as qualification methodology for ICs and modules. For emissions, they have developed into a standardized method. Development of universally accepted file formats for data exchange is on-going. Four main types of scanning have been implemented by this and other authors: Near-field EMI scanning, ESD scanning, radiated immunity scanning, and resonance scanning. This article concentrates on resonance scanning as a newly added method for automated EMC system analysis.


Development And Validation Of A Microcontroller Model For Emc, Shaohua Li, Hemant Bishnoi, Jason Whiles, Pius Ng, Haixiao Weng, David Pommerenke, Daryl G. Beetner Sep 2008

Development And Validation Of A Microcontroller Model For Emc, Shaohua Li, Hemant Bishnoi, Jason Whiles, Pius Ng, Haixiao Weng, David Pommerenke, Daryl G. Beetner

Electrical and Computer Engineering Faculty Research & Creative Works

Models of integrated circuits (ICs) allow printed circuit board (PCB) developers to predict radiated and conducted emissions early in board development and allow IC manufactures insight into how to build their ICs better for electromagnetic compatibility (EMC). A model of the power delivery network, similar to the ICEM or LECCS model, was developed for a microcontroller running a typical program and used to predict the noise voltage between the power and return planes of a PCB. The IC and package model was generated using the Apache tool suite. A model of the PCB was created using an electromagnetic cavity model …