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Analysis And Design Of Surface Micromachined Micromanipulators For Out-Of-Plane Micropositioning, Kimberly A. Jensen Jul 2003

Analysis And Design Of Surface Micromachined Micromanipulators For Out-Of-Plane Micropositioning, Kimberly A. Jensen

Theses and Dissertations

This thesis introduces two ortho-planar MEMS devices that can be used to position microcomponents: the XZ Micropositioning Mechanism and the XYZ Micromanipulator. The displacement and force relationships are presented. The devices were fabricated using surface micromachining processes and the resulting mechanisms were tested. A compliant XYZ Micromanipulator was also designed to reduce backlash and binding. In addition, several other MEMS positioners were fabricated and tested: the Micropositioning Platform Mechanism (MPM), the Ortho-planar Twisting Micromechanism (OTM), and the Ortho-planar Spring Micromechanism (OSM).


The Pseudo-Rigid-Body Model For Dynamic Predictions Of Macro And Micro Compliant Mechanisms, Scott Marvin Lyon Apr 2003

The Pseudo-Rigid-Body Model For Dynamic Predictions Of Macro And Micro Compliant Mechanisms, Scott Marvin Lyon

Theses and Dissertations

This work discusses the dynamic predictions of compliant mechanisms using the Pseudo-Rigid-Body model (PRBM). In order to improve the number of mechanisms that can be modeled, this research develops and identifies several key concepts in the behavior of beam segments where both ends are fixed to a rigid body (fixed-fixed flexible segments). A model is presented, and several examples are discussed. The dynamic behavior of several compliant segments is predicted using the PRBM and the results are compared to finite element analysis and experimental results. Details are presented as to the transient behavior of a typical uniform rectangular cross section …


Thermal Microactuators For Microelectromechanical Systems (Mems), Rebecca Cragun Mar 2003

Thermal Microactuators For Microelectromechanical Systems (Mems), Rebecca Cragun

Theses and Dissertations

Microactuators are needed to convert energy into mechanical work at the microscale. Thermal microactuators can be used to produce this needed mechanical work. The purpose of this research was to design, fabricate, and test thermal microactuators for use at the microscale in microelectromechanical systems (MEMS). The microactuators developed were tested to determine the magnitude of their deflection and estimate their force. Five groups of thermal microactuators were designed and tested. All of the groups used the geometrically constrained expansion of various segments to produce their deflection. The first group, Thermal Expansion Devices (TEDs), produced a rotational displacement and had deflections …


Mechanical Computing In Microelectromechanical Systems (Mems), Kenneth C. Bradley Mar 2003

Mechanical Computing In Microelectromechanical Systems (Mems), Kenneth C. Bradley

Theses and Dissertations

Mechanical computing devices in polysilicon-based microelectromechanical systems (MEMS) were designed with the goal of developing computing devices for harsh environments, such as those with high dose radiation and high temperatures, as well as devices that may be able to interface with molecular or biological computer systems. The devices that were designed include both analog and digital computing devices. The analog devices include integrators, differentials (summers), multipliers, and those that perform trigonometric functions. The digital devices that were designed are inverters, NAND, NOR, and XOR logic gates. Analog-to-digital (A-to-D) and digital-to-analog (D-to-A) converters were also designed. The designs were submitted to …


Stress Analysis Of Silicon Carbide Microeletromechanical Systems Using Raman Spectroscopy, Stanley J. Ness Mar 2003

Stress Analysis Of Silicon Carbide Microeletromechanical Systems Using Raman Spectroscopy, Stanley J. Ness

Theses and Dissertations

During the fabrication of Micro-Electro-Mechanical Systems (MEMS), residual stress is often induced in the thin films that are deposited to create these systems. These stresses can cause the device to fail due to buckling, curling, or fracture. Government and industry are looking for ways to characterize the stress during the deposition of thin films in order to reduce or eliminate device failure. Micro-Raman spectroscopy has been successfully used to analyze poly-silicon MEMS devices made with the Multi-User MEMS Process (MUMPS trade name). Micro-Raman spectroscopy was selected because it is nondestructive, fast and has the potential for in situ stress monitoring. …


The Effects Of Ionizing Radiation On Microelectromechanical Systems (Mems) Actuators: Electrostatic, Electrothermal, And Residual Stress, Jared R. Caffey Mar 2003

The Effects Of Ionizing Radiation On Microelectromechanical Systems (Mems) Actuators: Electrostatic, Electrothermal, And Residual Stress, Jared R. Caffey

Theses and Dissertations

The effects of ionizing radiation on the operation of polysilicon mmicroelectromechanical system (MEMS) electrostatic actuators, electrothermal actuators, and residual stress cantilevers were examined. Pre-irradiation, in-situ, and post-irradiation measurements were taken for the electrosatic and electrothermal actuators. The residual stress cantilevers were characterized before and after irradiation. All devices were irradiated to a total ionizing does of 1 megarad(Si) using both the Air Force Research Laboratory's low energy X-ray source and Co-60 gamma source.