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<p>Solder and soldering -- Materials<br />Thermal analysis<br />Lead-free electronics manufacturing processes<br />Ball grid array technology<br />Vibration</p>
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Thermal Characterization And Vibration Of Solder Alloys, Brandon Lee Brinkmeyer
Thermal Characterization And Vibration Of Solder Alloys, Brandon Lee Brinkmeyer
Masters Theses
"Recent legislation and growing environmental concerns have forced the electronics industry to discontinue the use of tin-lead (SnPb) solder. Although the legislation did not directly affect aerospace and defense industries, future transitions to lead-free (LF) solders are inevitable. Differences exist between these high reliability systems and consumer electronics, first of which is a very small production rate and a long life cycle which often leads to repair or rework procedures which introduce the potential for mixing of SnPb and LF solder. In this study, Sn-3Ag-0.5Cu (SAC305) was mixed with Sn-37Pb solder in amounts of 0, 25, 50, 75, and 100 …