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Hardness Characteristics In Electrodeposited Copper/Nickel Multilayer Systems., Li. Zhaojiang

Electronic Theses and Dissertations

Multilayered Cu/Ni thin films were grown epitaxially on copper substrate using electrodeposition method. The multilayers possess coherent interfaces with well-defined satellites surrounding the main Bragg peaks in the X-Ray diffractograms. Hardness values greater than those of the constituent materials, by a factor of two or better, were found. Also, a Hall-Petch type relationship between hardness and superlattice periodicity, that is, hardness is in proportion to the inverse of the square root of the superlattice periodicity, is determined for superlattice periodicity in the range of about 40 to 80 angstroms. When nickel thickness is fixed at about 50 angstroms, hardness is …