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Experimental And Numerical Evaluation Of Single Phase Adiabatic Flows In Plain And Enhanced Microchannels, Akhilesh V. Bapat Nov 2007

Experimental And Numerical Evaluation Of Single Phase Adiabatic Flows In Plain And Enhanced Microchannels, Akhilesh V. Bapat

Theses

Thermal Dissipation is a critical issue in the performance of semiconductor devices. The current practice is to use forced convection by air over a heat sink which is bonded to the microelectronic device. With increased packing density of the circuits inside a chip, large amounts of heat is generated and air cooling is no longer sufficient. Forced liquid convection using microchannels is considered to be a viable option for cooling of these microprocessor chips. This work deals with the evaluation of the single phase pressure drop in microchannels. There are two types of microchannels under consideration. Plain microchannels which have …


Flow Boiling Heat Transfer In Microchannels, D. Liu, S V. Garimella Jan 2007

Flow Boiling Heat Transfer In Microchannels, D. Liu, S V. Garimella

CTRC Research Publications

Flow boiling heat transfer to water in microchannels is experimentally investigated. The dimensions of the microchannels considered are 275 x 636 and 406 x 1063 um2. The experiments are conducted at inlet water temperatures in the range of 67–95°C and mass fluxes of 221–1283 kg/m2 s. The maximum heat flux investigated in the tests is 129 W/cm2 and the maximum exit quality is 0.2. Convective boiling heat transfer coefficients are measured and compared to predictions from existing correlations for larger channels. While an existing correlation was found to provide satisfactory prediction of the heat transfer coefficient in subcooled boiling in …


Fouling In Silicon Microchannel Designs Used For Ic Chip Cooling And Its Mitigation, Jeffrey L. Perry Jan 2007

Fouling In Silicon Microchannel Designs Used For Ic Chip Cooling And Its Mitigation, Jeffrey L. Perry

Theses

Particulate fouling studies with alumina and silica dispersions were performed in silicon, rectangular microchannels having hydraulic diameters between 220-225 μm. The particulates used ranged from the colloidal size range up to tens of microns in size (for particle aggregates). Data show for the most part the absence of particle depositions within the microchannels. This is even the case when there is an electrostatic attraction between the particles and the microchannel surface. The primary reason for this is due to the high wall shear stress at the microchannel walls. In contrast, the headers for the microchannels are quite susceptible to particulate …


Experimental Investigation Of Heat Transfer Rate In Micro-Channels, Pritish Ranjan Parida Jan 2007

Experimental Investigation Of Heat Transfer Rate In Micro-Channels, Pritish Ranjan Parida

LSU Master's Theses

Metal-based MHEs are of current interest due to the combination of high heat transfer performance and improved mechanical integrity. Efficient methods for fabrication and assembly of functional metal-based MHEs are essential to ensure the economic viability of such devices. The present study focuses on the results of heat transfer testing of assembled Cu- and Al- based microchannel heat exchanger (MHE) prototypes. Efficient fabrication of Cu- and Al- based high-aspect-ratio microscale structures (HARMS) have been achieved through molding replication using surface engineered, metallic mold inserts. Replicated metallic HARMS were assembled through eutectic bonding to form entirely Cu- and Al- based MHE …