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Chip Warpage Reduction Via Raised Free Bending And Re-Entrant (Auxetic) Trace Geometries, David Huitink, John Harris

Patents Granted

A microelectronic device and method of making the same including a substrate and at least one expansion layer that adds stress to the substrate when said substrate expands.

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Formulation And Aerosol Jet Printing Of Nickel Nanoparticle Ink For High-Temperature Microelectronic Applications And Patterned Graphene Growth, Nicholas Mckibben, Michael Curtis, Olivia Maryon, Mone’T Sawyer, Maryna Lazouskaya, Josh Eixenberger, Zhangxian Deng, David Estrada

Materials Science and Engineering Faculty Publications and Presentations

Aerosol jet printing (AJP) is an advanced manufacturing technique for directly writing nanoparticle inks onto target substrates. It is an emerging reliable, efficient, and environmentally friendly fabrication route for thin film electronics and advanced semiconductor packaging. This fabrication technique is highly regarded for its rapid prototyping, the flexibility of design, and fine feature resolution. Nickel is an attractive high-temperature packaging material due to its electrical conductivity, magnetism, and corrosion resistance. In this work, we synthesized nickel nanoparticles and formulated an AJP ink, which was printed on various material surfaces. Thermal sintering experiments were performed on the samples to explore the …

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