Digital Commons Network^™

Layer-By-Layer Nanoassembly Combined With Microfabrication Techniques For Microelectronics And Microelectromechanical Systems, Jingshi Shi

Doctoral Dissertations

The objective of this work is to investigate the combination of layer-by-layer self-assembly with microfabrication technology and its applications in microelectronics and MEMS.

One can assemble, on a standard silicon wafer, needed multilayers containing different nanoparticles and polymers and then apply various micromanufacturing techniques to form microdevices with nanostructured elements.

Alternate layer-by-layer self-assembly of linear polyions and colloidal silica at elevated temperatures have been firstly studied by QCM and SEM. LbL self-assembly and photolithography were combined to fabricate an indium resistor. The RTA method was employed in the fabrication. Hot-embossing technique as a reasonably fast and moderately expensive technique was …