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High-Pressure Torsion-Induced Grain Growth In Electrodeposited Nanocrystalline Ni, X. Z. Liao, A. R. Kilmametov, R. Z. Valiev, Hongsheng Gao, Xiaodong Li, A. K. Mukherjee, J. F. Blingert, Y. T. Zhu
High-Pressure Torsion-Induced Grain Growth In Electrodeposited Nanocrystalline Ni, X. Z. Liao, A. R. Kilmametov, R. Z. Valiev, Hongsheng Gao, Xiaodong Li, A. K. Mukherjee, J. F. Blingert, Y. T. Zhu
Faculty Publications
Deformation-induced grain growth has been reported in nanocrystalline (nc) materials under indentation and severe cyclic loading, but not under any other deformation mode. This raises an issue on critical conditions for grain growth in nc materials. This study investigates deformation-induced grain growth in electrodeposited nc Ni during high-pressure torsion (HPT). Our results indicate that high stress and severe plastic deformation are required for inducing grain growth, and the upper limit of grain size is determined by the deformation mode and parameters. Also, texture evolution suggests that grain-boundary-mediated mechanisms played a significant role in accommodating HPT strain.
Modeling Of The Effects Of Athermal Flow Strength And Activation Energy For Dislocation Glide On The Nanoindentation Creep Of Nickel Thin Film At Room Temperature
A.S. Md Abdul Haseeb
Nanoindentation creep behaviour of nickel at room temperature has been modeled based on the obstacle-controlled dislocation glide mechanism. Using the model, the effects of two important materials parameters viz. the activation free energy required by dislocation to overcome an obstacle without any aid from external stress, ΔF and the athermal flow strength, τ0, which is the flow strength of solids at 0 K are systematically studied. It has been found that ΔF plays a dominant role in room temperature creep properties of nickel. The role of ΔF is particularly dominant in determining the time dependent deformation. On the other hand, …
Modeling Of The Effects Of Athermal Flow Strength And Activation Energy For Dislocation Glide On The Nanoindentation Creep Of Nickel Thin Film At Room Temperature
A.S. Md Abdul Haseeb
Nanoindentation creep behaviour of nickel at room temperature has been modeled based on the obstacle-controlled dislocation glide mechanism. Using the model, the effects of two important materials parameters viz. the activation free energy required by dislocation to overcome an obstacle without any aid from external stress, ΔF and the athermal flow strength, τ0, which is the flow strength of solids at 0 K are systematically studied. It has been found that ΔF plays a dominant role in room temperature creep properties of nickel. The role of ΔF is particularly dominant in determining the time dependent deformation. On the other hand, …