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Layer-By-Layer Nanoassembly Combined With Microfabrication Techniques For Microelectronics And Microelectromechanical Systems, Jingshi Shi

Doctoral Dissertations

The objective of this work is to investigate the combination of layer-by-layer self-assembly with microfabrication technology and its applications in microelectronics and MEMS.

One can assemble, on a standard silicon wafer, needed multilayers containing different nanoparticles and polymers and then apply various micromanufacturing techniques to form microdevices with nanostructured elements.

Alternate layer-by-layer self-assembly of linear polyions and colloidal silica at elevated temperatures have been firstly studied by QCM and SEM. LbL self-assembly and photolithography were combined to fabricate an indium resistor. The RTA method was employed in the fabrication. Hot-embossing technique as a reasonably fast and moderately expensive technique was …

Fully Compliant Tensural Bistable Mechanisms (Ftbm) With On-Chip Thermal Actuation, Daniel L. Wilcox

Theses and Dissertations

The Fully compliant Tensural Bistable Mechanism (FTBM) class is introduced. The class consists of fully compliant linear bistable mechanisms that achieve much of their displacement and bistable behavior through tension loading of compliant segments. Multiple topologies of designs arising from the FTBM class were designed using a finite element analysis (FEA) model with optimization. In a coupled design approach, thermal actuators were optimized to the force and displacement requirements of the bistable mech-anisms, and selected FTBM devices were combined in switching systems with the result-ing Thermomechanical In-plane Microactuators (TIMs) and Amplified Thermomechanical In-plane Microactuators (ATIMs). Successful on-chip actuation was demonstrated. …

Modeling And Control Of Surface Micromachined Thermal Actuators, Robert K. Messenger

Theses and Dissertations

A model that accurately describes the transient and steady-state response of thermal microactuators is desirable to provide guidance for design and operation. However, modeling the full response of thermal actuators is challenging due to the temperature-dependent material properties and nonlinear deformations that must be included to obtain accurate results. To meet these challenges a three-dimensional multi-physics nonlinear finite-element model was developed using commercial code. The Thermomechanical Inplane Microactuator (TIM) was chosen as a candidate application to validate the model. TIMs were fabricated using the SUMMiT V™ process and their response was measured using a high-speed camera. The TIMs were modeled …