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Tensorial Stress−Strain Fields And Large Elastoplasticity As Well As Friction In Diamond Anvil Cell Up To 400 Gpa, Valery I. Levitas, Mehdi Kamrani, Biao Feng Oct 2019

Tensorial Stress−Strain Fields And Large Elastoplasticity As Well As Friction In Diamond Anvil Cell Up To 400 Gpa, Valery I. Levitas, Mehdi Kamrani, Biao Feng

Aerospace Engineering Publications

Various phenomena (fracture, phase transformations, and chemical reactions) studied under extreme pressures in diamond anvil cell are strongly affected by fields of all components of stress and plastic strain tensors. However, they could not be measured. Here, we suggest a coupled experimental−theoretical−computational approach that allowed us (using published experimental data) to refine, calibrate, and verify models for elastoplastic behavior and contact friction for tungsten (W) and diamond up to 400 GPa and reconstruct fields of all components of stress and large plastic strain tensors in W and diamond. Despite the generally accepted strain-induced anisotropy, strain hardening, and path-dependent ...


Nde In-Process For Metal Parts Fabricated Using Powder Based Additive Manufacturing, Leonard J. Bond, Lucas W. Koester, Hossein Taheri Mar 2019

Nde In-Process For Metal Parts Fabricated Using Powder Based Additive Manufacturing, Leonard J. Bond, Lucas W. Koester, Hossein Taheri

Aerospace Engineering Publications

Ensuring adequate quality for additive manufactured (AM) materials presents unique metrology challenges to the on-line process measurement and nondestructive evaluation (NDE) communities. AM parts now have complex forms that are not possible using subtractive manufacturing and there are moves for their use in safety criticality components. This paper briefly reviews the status, challenges and metrology opportunities throughout the AM process from powder to finished parts. The primary focus is on new acoustic signatures that have been demonstrated to correlate process parameters with on-line measurement for monitoring and characterization during the build. In-process, quantitative characterization and monitoring of material state is ...


Slip Of Shuffle Screw Dislocations Through Tilt Grain Boundaries In Silicon, Hao Chen, Valery Levitas, Liming Xiong Feb 2019

Slip Of Shuffle Screw Dislocations Through Tilt Grain Boundaries In Silicon, Hao Chen, Valery Levitas, Liming Xiong

Aerospace Engineering Publications

In this paper, molecular dynamics (MD) simulations of the interaction between tilt grain boundaries (GBs) and a shuffle screw dislocation in silicon are performed. Results show that dislocations transmit into the neighboring grain for all GBs in silicon. For Σ3, Σ9 and Σ19 GBs, when a dislocation interacts with a heptagon site, it transmits the GB directly. In contrast, when interacting with a pentagon site, it first cross slips to a plane on the heptagon site and then transmits the GB. The energy barrier is also quantified using the climbing image nudged elastic band (CINEB) method. Results show that Σ3 ...