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Vibration-Based In-Situ Detection And Quantification Of Delamination In Composite Plates, Hanfei Mei, Asaad Migot, Mohammad Faisal Haider, Roshan Joseph, Md Yeasin Bhuiyan, Victor Giurgiutiu
Vibration-Based In-Situ Detection And Quantification Of Delamination In Composite Plates, Hanfei Mei, Asaad Migot, Mohammad Faisal Haider, Roshan Joseph, Md Yeasin Bhuiyan, Victor Giurgiutiu
Faculty Publications
This paper presents a new methodology for detecting and quantifying delamination in composite plates based on the high-frequency local vibration under the excitation of piezoelectric wafer active sensors. Finite-element-method-based numerical simulations and experimental measurements were performed to quantify the size, shape, and depth of the delaminations. Two composite plates with purpose-built delaminations of different sizes and depths were analyzed. In the experiments, ultrasonic C-scan was applied to visualize the simulated delaminations. In this methodology, piezoelectric wafer active sensors were used for the high-frequency excitation with a linear sine wave chirp from 1 to 500 kHz and a scanning laser Doppler …
Vibration-Based In-Situ Detection And Quantification Of Delamination In Composite Plates, Hanfei Mei, Asaad Migot, Mohammad Faisal Haider, Roshan Joseph, Md Yeasin Bhuiyan, Victor Giurgiutiu
Vibration-Based In-Situ Detection And Quantification Of Delamination In Composite Plates, Hanfei Mei, Asaad Migot, Mohammad Faisal Haider, Roshan Joseph, Md Yeasin Bhuiyan, Victor Giurgiutiu
Faculty Publications
This paper presents a new methodology for detecting and quantifying delamination in composite plates based on the high-frequency local vibration under the excitation of piezoelectric wafer active sensors. Finite-element-method-based numerical simulations and experimental measurements were performed to quantify the size, shape, and depth of the delaminations. Two composite plates with purpose-built delaminations of different sizes and depths were analyzed. In the experiments, ultrasonic C-scan was applied to visualize the simulated delaminations. In this methodology, piezoelectric wafer active sensors were used for the high-frequency excitation with a linear sine wave chirp from 1 to 500 kHz and a scanning laser Doppler …