Open Access. Powered by Scholars. Published by Universities.®

Digital Commons Network

Open Access. Powered by Scholars. Published by Universities.®

PDF

Mechanical Engineering

Selected Works

Tin

Articles 1 - 15 of 15

Full-Text Articles in Entire DC Network

Influence Of Ni Nanoparticle On The Morphology And Growth Of Interfacial Intermetallic Compounds Between Sn-3.8ag-0.7cu Lead-Free Solder And Copper Substrate Feb 2013

Influence Of Ni Nanoparticle On The Morphology And Growth Of Interfacial Intermetallic Compounds Between Sn-3.8ag-0.7cu Lead-Free Solder And Copper Substrate

A.S. Md Abdul Haseeb

This paper reports on the effects of adding Ni nanoparticles to a Sn-3.8Ag-0.7Cu solder. The nanocomposite was prepared by manual blending of SAC solder paste with various percentages of Ni particles. Results showed that the addition of Ni nanoparticles did not bring any significant change in the onset melting temperature of the solder. An increase in the weight percentage of nanoparticles in the solder caused an increase of the wetting angle and a decrease of spreading rate. Moreover, the addition of Ni nanoparticles changed the interfacial intermetallic compound morphology from a scalloped structure into a planar type structure ...


Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate Jan 2013

Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact ...


Effects Of Hydroquinone And Gelatin On The Electrodeposition Of Sn-Bi Low Temperature Pb-Free Solder Jan 2013

Effects Of Hydroquinone And Gelatin On The Electrodeposition Of Sn-Bi Low Temperature Pb-Free Solder

A.S. Md Abdul Haseeb

The effects of an antioxidant, hydroquinone (HQ) and a grain refining additive, gelatin, on the electroplating characteristics of Sn-Bi alloys were investigated. Methane sulfonic acid (MSA) based plating baths with varying contents of additives were prepared and the electrochemical behavior of each bath was investigated. The combination of HQ and gelatin successfully reduces the deposition potential gap between the elements hence facilitates the co-deposition of Sn-Bi in this plating bath. Compact, adherent deposits could be obtained through the synergistic effects of these two additives. The electroplated Sn-Bi deposits showed a decrease in Bi content with increasing current density. Near eutectic ...


Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate Jan 2013

Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact ...


Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate Jan 2013

Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact ...


Electrodeposition Of Lead-Free Solder Alloys Jan 2013

Electrodeposition Of Lead-Free Solder Alloys

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)-free solder alloys, so that new studies can be carried out to solve processing issues. Design/methodology/approach - The paper reviews the available reports on the electrodeposition of tin (Sn)-based solder systems and identifies the challenges in this area. Findings - Compositional control remains a major challenge in this area, where the achievement of desired composition for binary and ternary alloys is subjected to uncertainties. The use of chelating agents in the bath and optimization of parameters can assist the achievement of ...


Failure Analysis Of Superheater Tube Supports Of The Primary Reformer In A Fertilizer Factory Jan 2013

Failure Analysis Of Superheater Tube Supports Of The Primary Reformer In A Fertilizer Factory

A.S. Md Abdul Haseeb

Eutectic Sn-Bi alloy is gaining considerable attention in the electronic packaging industry because of its favorable properties such as low melting temperature, good wettability, and good mechanical properties. Miniaturization of electronic devices requires small solder bumps, a few tens of micrometers in diameter. Electrodeposition is a reliable technique for the deposition of small volume of solder. This work focuses on the formation of eutectic Sn-Bi solder by reflowing a metal stack containing sequentially electrodeposited Sn and Bi layers. The effects of layering sequence on the composition and microstructure of the resulting alloy is investigated. Irrespective of the layering sequence, a ...


Stability Of Molybdenum Nanoparticles In Sn-3.8ag-0.7cu Solder During Multiple Reflow And Their Influence On Interfacial Intermetallic Compounds Feb 2012

Stability Of Molybdenum Nanoparticles In Sn-3.8ag-0.7cu Solder During Multiple Reflow And Their Influence On Interfacial Intermetallic Compounds

A.S. Md Abdul Haseeb

This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 °C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions ...


Die Attach Properties Of Zn-Al-Mg-Ga Based High-Temperature Lead-Free Solder On Cu Lead-Frame Jan 2012

Die Attach Properties Of Zn-Al-Mg-Ga Based High-Temperature Lead-Free Solder On Cu Lead-Frame

A.S. Md Abdul Haseeb

No abstract provided.


Effects Of Addition Of Copper Particles Of Different Size To Sn-3.5ag Solder Dec 2011

Effects Of Addition Of Copper Particles Of Different Size To Sn-3.5ag Solder

A.S. Md Abdul Haseeb

No abstract provided.


Effects Of Co Nanoparticle Addition To Sn-3.8ag-0.7cu Solder On Interfacial Structure After Reflow And Ageing May 2011

Effects Of Co Nanoparticle Addition To Sn-3.8ag-0.7cu Solder On Interfacial Structure After Reflow And Ageing

A.S. Md Abdul Haseeb

Effects of Co nanoparticle additions to Sn-3.8Ag-0.7Cu on the structure of solder/copper interface have been studied after reflow and high temperature ageing (150 °C, up to 1008 h). Results show that the Co nanoparticles substantially suppress the growth of Cu3Sn but enhance Cu 6Sn5 growth. Cobalt nanoparticles reduce interdiffusion coefficient in Cu3Sn. It is suggested that the Co nanoparticles undergo surface dissolution during reflow and exert their influence, at least partially, through alloying effect. © 2011 Elsevier Ltd. All rights reserved.


Addition Of Cobalt Nanoparticles Into Sn-3.8ag-0.7cu Lead-Free Solder By Paste Mixing Jan 2011

Addition Of Cobalt Nanoparticles Into Sn-3.8ag-0.7cu Lead-Free Solder By Paste Mixing

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn-3.8Ag-0.7Cu solder. Design/methodology/approach - Cobalt (Co) nanoparticles were added to Sn-Ag-Cu solders by thoroughly blending various weight percentages (0-2.0 wt%) of Co nanoparticles with near eutectic SAC387 solder paste. Blending was done mechanically for 30 min to ensure a homogeneous mixture. The paste mixture was then reflowed on a hot plate at 250°C for 45 s. The melting points of nanocomposite solder were determined by differential scanning calorimetry. Spreading rate of nanocomposite was calculated following ...


Interfacial Reactions Between Sn-3.5 Ag Solder And Ni-W Alloy Films Jan 2011

Interfacial Reactions Between Sn-3.5 Ag Solder And Ni-W Alloy Films

A.S. Md Abdul Haseeb

Nickel based alloys are currently being investigated in an effort to develop stable barrier films between lead free solder and copper substrate. In this study, interfacial reactions between Ni-W alloy films and Sn-3.5 Ag solder have been investigated. Ni-W alloys films with tungsten content in the range of 5.0-18.0 at.% were prepared on copper substrate by electrodeposition in ammonia citrate bath. Solder joints were prepared on the Ni-W coated substrate at a reflow temperature of 250 °C. The solder joint interface was investigated by Cross-sectional scanning electron microscopy, energy dispersive X-ray spectroscopy and electron back scatter diffraction ...


Interfacial Reaction And Dissolution Behavior Of Cu Substrate In Molten Sn-3.8ag-0.7cu In The Presence Of Mo Nanoparticles Jan 2011

Interfacial Reaction And Dissolution Behavior Of Cu Substrate In Molten Sn-3.8ag-0.7cu In The Presence Of Mo Nanoparticles

A.S. Md Abdul Haseeb

Purpose - In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid-liquid interface. The purpose of this paper is to study the effect of the presence of molybdenum nanoparticles on the dissolution of copper and the formation of interfacial IMC. Design/methodology/approach - Cu wire having a diameter of 250 μm is immersed in liquid composite solders at 250° up to 15 min. Composite solder was prepared by adding various amount of Mo nanoparticles into the Sn-3.8Ag-0.7Cu (SAC) solder paste. The dissolution behavior of Cu ...


Understanding The Effects Of Addition Of Copper Nanoparticles To Sn-3.5 Ag Solder Jan 2011

Understanding The Effects Of Addition Of Copper Nanoparticles To Sn-3.5 Ag Solder

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to focus on the fabrication of SAC nanocomposites solder and discuss the effects of nanoCu addition on the structure and properties of resulted nanocomposite solder. Design/methodology/ approach - Ball milling is a nonequilibrium processing technique for producing composite metal particles with submicron homogeneity by the repeated cold welding and fracture of powder particles. This method is believed to offer good processablity, precise control over the solder composition, and produce more homogeneous mixture. Findings - It is found that the melting temperature, the wetting behaviour, and hardness are improved when the Cu nanoparticles are added ...