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Influence Of Ni Nanoparticle On The Morphology And Growth Of Interfacial Intermetallic Compounds Between Sn-3.8ag-0.7cu Lead-Free Solder And Copper Substrate
A.S. Md Abdul Haseeb
This paper reports on the effects of adding Ni nanoparticles to a Sn-3.8Ag-0.7Cu solder. The nanocomposite was prepared by manual blending of SAC solder paste with various percentages of Ni particles. Results showed that the addition of Ni nanoparticles did not bring any significant change in the onset melting temperature of the solder. An increase in the weight percentage of nanoparticles in the solder caused an increase of the wetting angle and a decrease of spreading rate. Moreover, the addition of Ni nanoparticles changed the interfacial intermetallic compound morphology from a scalloped structure into a planar type structure, enhanced the …
Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and …
Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and …
Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and …