Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 3 of 3
Full-Text Articles in Entire DC Network
Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and …
Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and …
Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and …