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Stability Of Molybdenum Nanoparticles In Sn-3.8ag-0.7cu Solder During Multiple Reflow And Their Influence On Interfacial Intermetallic Compounds
A.S. Md Abdul Haseeb
This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 °C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions. Molybdenum nanoparticles do not appear to …
Effects Of Addition Of Copper Particles Of Different Size To Sn-3.5ag Solder
Effects Of Addition Of Copper Particles Of Different Size To Sn-3.5ag Solder
A.S. Md Abdul Haseeb
No abstract provided.