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Die Attach Properties Of Zn-Al-Mg-Ga Based High-Temperature Lead-Free Solder On Cu Lead-Frame, Haseeb Asma
Die Attach Properties Of Zn-Al-Mg-Ga Based High-Temperature Lead-Free Solder On Cu Lead-Frame, Haseeb Asma
Haseeb ASMA
Several candidate alloys have been suggested as high-temperature lead-free solder for Si die attachment by different researchers. Among them, Zn-Al based alloys have proper melting range and excellent thermal/electrical properties. In this study, Zn-Al-Mg-Ga solder wire was used to attach Ti/Ni/Ag metallized Si die on Cu lead-frame in an automatic die attach machine. Die attachment was performed in a forming gas environment at temperature ranging from 370 to 400 A degrees C. At the interface with Cu lead-frame, CuZn(4), Cu(5)Zn(8) and CuZn intermetallic compound (IMC) layers were formed. At the interface with Si, Al(3)Ni(2) IMC formed when 200 nm Ag …