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Nanoindentation And Micro-Mechanical Fracture Toughness Of Electrodeposited Nanocrystalline Ni-W Alloy Films Apr 2012

Nanoindentation And Micro-Mechanical Fracture Toughness Of Electrodeposited Nanocrystalline Ni-W Alloy Films

A.S. Md Abdul Haseeb

Nanocrystalline nickel-tungsten alloys have great potential in the fabrication of components for microelectromechanical systems. Here the fracture toughness of Ni-12.7 at.%W alloy micro-cantilever beams was investigated. Micro-cantilevers were fabricated by UV lithography and electrodeposition and notched by focused ion beam machining. Load was applied using a nanoindenter and fracture toughness was calculated from the fracture load. Fracture toughness of the Ni-12.7 at.%W was in the range of 1.49-5.14 MPa √m. This is higher than the fracture toughness of Si (another important microelectromechanical systems material), but considerably lower than that of electrodeposited nickel and other nickel based alloys. © 2012 Elsevier …


Nanoindentation And Micro-Mechanical Fracture Toughness Of Electrodeposited Nanocrystalline Ni-W Alloy Films Apr 2012

Nanoindentation And Micro-Mechanical Fracture Toughness Of Electrodeposited Nanocrystalline Ni-W Alloy Films

A.S. Md Abdul Haseeb

Nanocrystalline nickel-tungsten alloys have great potential in the fabrication of components for microelectromechanical systems. Here the fracture toughness of Ni-12.7 at.%W alloy micro-cantilever beams was investigated. Micro-cantilevers were fabricated by UV lithography and electrodeposition and notched by focused ion beam machining. Load was applied using a nanoindenter and fracture toughness was calculated from the fracture load. Fracture toughness of the Ni-12.7 at.%W was in the range of 1.49-5.14 MPa √m. This is higher than the fracture toughness of Si (another important microelectromechanical systems material), but considerably lower than that of electrodeposited nickel and other nickel based alloys. © 2012 Elsevier …


Degradation Of Automotive Materials In Palm Biodiesel Apr 2012

Degradation Of Automotive Materials In Palm Biodiesel

A.S. Md Abdul Haseeb

As compared to petroleum diesel, biodiesel is more corrosive for automotive materials. Studies on the characterization of corrosion products of fuel exposed automotive materials are scarce. Automotive fuel system and engine components are made from different ferrous and non-ferrous materials. The present study aims to investigate the corrosion products of different types of automotive materials such as copper, brass, aluminum and cast iron upon exposure to diesel and palm biodiesel. Changes in fuel properties due to exposure of different materials were also examined. Degradation of metal surface was characterized by digital camera, SEM/EDS and X-ray diffraction (XRD). Fuel properties were …


Preparation And Low-Temperature Sintering Of Cu Nanoparticles For High-Power Devices Apr 2012

Preparation And Low-Temperature Sintering Of Cu Nanoparticles For High-Power Devices

A.S. Md Abdul Haseeb

One of the fundamental requirements for high-temperature electronic packaging is reliable silicon attach with low and stable electrical resistance. This paper presents a study conducted on Cu nanoparticles as an alternative lead-free interconnect material for high-temperature applications. Cu nanoparticles were prepared using pulsed wire evaporation technique in water medium. Pure Cu nanoparticles without any organic mixture were used in this paper. An economical approach to extract the nanoparticles from water was established. In situ Cu nanoparticles oxide reduction was successfully done using forming gas $({\rm N}-{2}{\hbox{-}}5\%{\rm H}-{2})$. Cross-section analysis on bonded interface shows onset of Cu nanoparticles sintering at 400$^{\circ}{\rm …


Stability Of Molybdenum Nanoparticles In Sn-3.8ag-0.7cu Solder During Multiple Reflow And Their Influence On Interfacial Intermetallic Compounds Feb 2012

Stability Of Molybdenum Nanoparticles In Sn-3.8ag-0.7cu Solder During Multiple Reflow And Their Influence On Interfacial Intermetallic Compounds

A.S. Md Abdul Haseeb

This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 °C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions. Molybdenum nanoparticles do not appear to …


Die Attach Properties Of Zn-Al-Mg-Ga Based High-Temperature Lead-Free Solder On Cu Lead-Frame Jan 2012

Die Attach Properties Of Zn-Al-Mg-Ga Based High-Temperature Lead-Free Solder On Cu Lead-Frame

A.S. Md Abdul Haseeb

No abstract provided.


Effects Of Addition Of Copper Particles Of Different Size To Sn-3.5ag Solder Dec 2011

Effects Of Addition Of Copper Particles Of Different Size To Sn-3.5ag Solder

A.S. Md Abdul Haseeb

No abstract provided.


Gas Sensors Based On One Dimensional Nanostructured Metal-Oxides: A Review Dec 2011

Gas Sensors Based On One Dimensional Nanostructured Metal-Oxides: A Review

A.S. Md Abdul Haseeb

Recently one dimensional (1-D) nanostructured metal-oxides have attracted much attention because of their potential applications in gas sensors. 1-D nanostructured metal-oxides provide high surface to volume ratio, while maintaining good chemical and thermal stabilities with minimal power consumption and low weight. In recent years, various processing routes have been developed for the synthesis of 1-D nanostructured metal-oxides such as hydrothermal, ultrasonic irradiation, electrospinning, anodization, sol-gel, molten-salt, carbothermal reduction, solid-state chemical reaction, thermal evaporation, vapor-phase transport, aerosol, RF sputtering, molecular beam epitaxy, chemical vapor deposition, gas-phase assisted nanocarving, UV lithography and dry plasma etching. A variety of sensor fabrication processing routes …