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Effects Of Co Nanoparticle Addition To Sn-3.8ag-0.7cu Solder On Interfacial Structure After Reflow And Ageing
A.S. Md Abdul Haseeb
Effects of Co nanoparticle additions to Sn-3.8Ag-0.7Cu on the structure of solder/copper interface have been studied after reflow and high temperature ageing (150 °C, up to 1008 h). Results show that the Co nanoparticles substantially suppress the growth of Cu3Sn but enhance Cu 6Sn5 growth. Cobalt nanoparticles reduce interdiffusion coefficient in Cu3Sn. It is suggested that the Co nanoparticles undergo surface dissolution during reflow and exert their influence, at least partially, through alloying effect. © 2011 Elsevier Ltd. All rights reserved.
Addition Of Cobalt Nanoparticles Into Sn-3.8ag-0.7cu Lead-Free Solder By Paste Mixing
Addition Of Cobalt Nanoparticles Into Sn-3.8ag-0.7cu Lead-Free Solder By Paste Mixing
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn-3.8Ag-0.7Cu solder. Design/methodology/approach - Cobalt (Co) nanoparticles were added to Sn-Ag-Cu solders by thoroughly blending various weight percentages (0-2.0 wt%) of Co nanoparticles with near eutectic SAC387 solder paste. Blending was done mechanically for 30 min to ensure a homogeneous mixture. The paste mixture was then reflowed on a hot plate at 250°C for 45 s. The melting points of nanocomposite solder were determined by differential scanning calorimetry. Spreading rate of nanocomposite was calculated following the JIS Z3198-3 standard. …
Interfacial Reaction And Dissolution Behavior Of Cu Substrate In Molten Sn-3.8ag-0.7cu In The Presence Of Mo Nanoparticles
A.S. Md Abdul Haseeb
Purpose - In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid-liquid interface. The purpose of this paper is to study the effect of the presence of molybdenum nanoparticles on the dissolution of copper and the formation of interfacial IMC. Design/methodology/approach - Cu wire having a diameter of 250 μm is immersed in liquid composite solders at 250° up to 15 min. Composite solder was prepared by adding various amount of Mo nanoparticles into the Sn-3.8Ag-0.7Cu (SAC) solder paste. The dissolution behavior of Cu substrate is …
Understanding The Effects Of Addition Of Copper Nanoparticles To Sn-3.5 Ag Solder
Understanding The Effects Of Addition Of Copper Nanoparticles To Sn-3.5 Ag Solder
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to focus on the fabrication of SAC nanocomposites solder and discuss the effects of nanoCu addition on the structure and properties of resulted nanocomposite solder. Design/methodology/ approach - Ball milling is a nonequilibrium processing technique for producing composite metal particles with submicron homogeneity by the repeated cold welding and fracture of powder particles. This method is believed to offer good processablity, precise control over the solder composition, and produce more homogeneous mixture. Findings - It is found that the melting temperature, the wetting behaviour, and hardness are improved when the Cu nanoparticles …