Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 2 of 2
Full-Text Articles in Entire DC Network
Piezoelectric In Situ Transmission Electron Microscopy Technique For Direct Observations Of Fatigue Damage Accumulation In Constrained Metallic Thin Films, Xiaoli Tan, T. Du, J.K. Shang
Piezoelectric In Situ Transmission Electron Microscopy Technique For Direct Observations Of Fatigue Damage Accumulation In Constrained Metallic Thin Films, Xiaoli Tan, T. Du, J.K. Shang
Xiaoli Tan
A piezoelectricin situtransmission electron microscopy(TEM) technique has been developed to observe the damage mechanism in constrained metallic thin films under cyclic loading. The technique was based on the piezoelectric actuation of a multilayered structure in which a metallic thin film was sandwiched between a piezoelectric actuator and a silicon substrate. An alternating electric field with a static offset was applied on the piezoelectric actuator to drive the crack growth in the thin metallic layer while the sample was imaged in TEM. The technique was demonstrated on solder thin films where cavitation was found to be the dominant fatigue damage mechanism.
In Situ Transmission Electron Microscopy Study Of Electric-Field-Induced Microcracking In Single Crystal Pb(Mg1/3nb2/3)O3–Pbtio3, Z. Xu, Xiaoli Tan, P. Han, J.K. Shang
In Situ Transmission Electron Microscopy Study Of Electric-Field-Induced Microcracking In Single Crystal Pb(Mg1/3nb2/3)O3–Pbtio3, Z. Xu, Xiaoli Tan, P. Han, J.K. Shang
Xiaoli Tan
In this letter, we report in situ transmission electron microscopy (TEM) study of effect of a cyclic electric field on microcracking in a single crystal piezoelectric 0.66Pb(Mg1/3Nb2/3)O3–0.34PbTiO3. A TEM heating stage was modified to permit the in situ application of an electric field on the TEM sample surface. Microcrack initiation from a fine pore under an applied cyclic electric field was directly observed in the piezoelectric single crystal. Experimental procedures for in situ TEM studies were described.