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Printing, Characterization, And Mechanical Testing Of Additively Manufactured Refractory Metal Alloys, Brianna M. Sexton
Printing, Characterization, And Mechanical Testing Of Additively Manufactured Refractory Metal Alloys, Brianna M. Sexton
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Refractory metal alloys in the tungsten molybdenum rhenium ternary system were additively manufactured using laser power bed fusion. Four ternary alloys with varying concentrations of tungsten, molybdenum, and rhenium were manufactured and manufactured again with an addition of 1 wt% hafnium carbide. Samples were heat treated to heal cracks, reduce porosity, and reduce inhomogeneity. Material microstructure was characterized before and after heat treatment using microscopy, energy dispersive x-ray spectroscopy, and electron backscatter diffraction mapping. Mechanical testing was conducted on both three-point bend specimens and compression specimens, resulting in maximum bending strengths of 677.86 MPa, and maximum compression 0.2% yield strengths …
Molecular Dynamics Simulation Study Of A Polymer Droplet Transport Over An Array Of Spherical Nanoparticles, Anish Thomas
Molecular Dynamics Simulation Study Of A Polymer Droplet Transport Over An Array Of Spherical Nanoparticles, Anish Thomas
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This study uses molecular dynamics simulations to evaluate the dynamic behavior of a partially wetting polymer droplet driven over a nanostructured interface. We consider the bead-spring model to represent a polymeric liquid that partially wets a rough surface composed of a periodic array of spherical particles. Results show that at sufficiently small values of external force, the droplet remains pinned at the particle's surface, whereas above the threshold its motion consists of alternating periods of pinning and rapid displacements between neighboring particles. The latter process involves large periodic variation of the advancing and receding contact angles due to the attachment …
Correlating In-Situ Monitoring Data With Internal Defects In Laser Powder Bed Fusion Additive Manufacturing, Andrew J. Harvey
Correlating In-Situ Monitoring Data With Internal Defects In Laser Powder Bed Fusion Additive Manufacturing, Andrew J. Harvey
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The presence of defects within laser powder bed fusion (LPBF) parts can lead to reduced mechanical properties and life of components. Because of this, the ability to detect these defects within the parts is critical before the part is subject to its intended loading. Normally the parts are subjected to a quality analysis once they are completed however, this process is typically expensive and time consuming. A solution for these problems is to sense the creation of defects and pores in the parts in-situ, while the part is being fabricated. One proposed method of in-situ monitoring is visible spectroscopy to …
Fabrication And Characterizations Of Lithium Aluminum Titanate Phosphate Solid Electrolytes For Li-Based Batteries, Anurag Yaddanapudi
Fabrication And Characterizations Of Lithium Aluminum Titanate Phosphate Solid Electrolytes For Li-Based Batteries, Anurag Yaddanapudi
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Demands for electric vehicles and flexible electronics have escalated research in developing high-performance lithium batteries based on solid-state chemistry. The present work is to develop highly-conductive and flexible solid electrolyte for such applications. Lithium aluminum titanate phosphate (LATP or Li1.3Al0.3Ti1.7(PO4)3), both in ceramic pellets and free-standing composite membranes, have been fabricated. The crystal structure, surface morphology, and ionic conductivity are systematically studied. LATP pellets are prepared using solid state reaction approach. The results indicate that calcine temperature has significant impacts on the phase impurity and sintering temperature and duration have more impacts on the grain size and porosity of LATP …
Constitutive Modeling Of Creep In Leaded And Lead-Free Solder Alloys Using Constant Strain Rate Tensile Testing, Eric Thomas Stang
Constitutive Modeling Of Creep In Leaded And Lead-Free Solder Alloys Using Constant Strain Rate Tensile Testing, Eric Thomas Stang
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Environmental and safety concerns have necessitated a phase-out of lead-based alloys, which are often used in electronics solder applications. In order to properly assess suitable replacement materials, it is necessary to understand the deformation mechanisms relevant to the application. In the case of electronics solder, creep is an important mechanism that must be considered in the design of reliable devices and systems. In this study, Power-Law and Garofalo constitutive creep models were derived for two medium temperature solder alloys. The first alloy is known by the commercial name Indalloy 236 and is a quaternary alloy of lead, antimony, tin, and …