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Multi-Mode Guided Wave Detection Of Various Composite Damage Types, Hanfei Mei, Robin James, Victor Giurgiutiu
Multi-Mode Guided Wave Detection Of Various Composite Damage Types, Hanfei Mei, Robin James, Victor Giurgiutiu
Faculty Publications
This paper presents a new methodology for detecting various types of composite damage, such as delamination and impact damage, through the application of multimode guided waves. The basic idea is that various wave modes have different interactions with various types of composite damage. Using this method, selective excitations of pure-mode guided waves were achieved using adjustable angle beam transducers (ABTs). The tuning angles of various wave modes were calculated using Snell’s law applied to the theoretical dispersion curves of composite plates. Pitch–catch experiments were conducted on a 2-mm quasi-isotropic carbon fiber-reinforced polymer (CFRP) composite plate to validate the excitations of …
Vibration-Based In-Situ Detection And Quantification Of Delamination In Composite Plates, Hanfei Mei, Asaad Migot, Mohammad Faisal Haider, Roshan Joseph, Md Yeasin Bhuiyan, Victor Giurgiutiu
Vibration-Based In-Situ Detection And Quantification Of Delamination In Composite Plates, Hanfei Mei, Asaad Migot, Mohammad Faisal Haider, Roshan Joseph, Md Yeasin Bhuiyan, Victor Giurgiutiu
Faculty Publications
This paper presents a new methodology for detecting and quantifying delamination in composite plates based on the high-frequency local vibration under the excitation of piezoelectric wafer active sensors. Finite-element-method-based numerical simulations and experimental measurements were performed to quantify the size, shape, and depth of the delaminations. Two composite plates with purpose-built delaminations of different sizes and depths were analyzed. In the experiments, ultrasonic C-scan was applied to visualize the simulated delaminations. In this methodology, piezoelectric wafer active sensors were used for the high-frequency excitation with a linear sine wave chirp from 1 to 500 kHz and a scanning laser Doppler …
Vibration-Based In-Situ Detection And Quantification Of Delamination In Composite Plates, Hanfei Mei, Asaad Migot, Mohammad Faisal Haider, Roshan Joseph, Md Yeasin Bhuiyan, Victor Giurgiutiu
Vibration-Based In-Situ Detection And Quantification Of Delamination In Composite Plates, Hanfei Mei, Asaad Migot, Mohammad Faisal Haider, Roshan Joseph, Md Yeasin Bhuiyan, Victor Giurgiutiu
Faculty Publications
This paper presents a new methodology for detecting and quantifying delamination in composite plates based on the high-frequency local vibration under the excitation of piezoelectric wafer active sensors. Finite-element-method-based numerical simulations and experimental measurements were performed to quantify the size, shape, and depth of the delaminations. Two composite plates with purpose-built delaminations of different sizes and depths were analyzed. In the experiments, ultrasonic C-scan was applied to visualize the simulated delaminations. In this methodology, piezoelectric wafer active sensors were used for the high-frequency excitation with a linear sine wave chirp from 1 to 500 kHz and a scanning laser Doppler …
Micro Modeling Study Of Cathode/Electrolyte Interfacial Stresses For Solid Oxide Fuel Cells, Xinfang Jin, Xingjian Xue
Micro Modeling Study Of Cathode/Electrolyte Interfacial Stresses For Solid Oxide Fuel Cells, Xinfang Jin, Xingjian Xue
Faculty Publications
Delamination of the cathode/electrolyte interface is an important degradation phenomenon in solid oxide fuel cells (SOFCs). While the thermal stress has been widely recognized as one of the major reasons for such delamination failures, the role of chemical stress does not receive too much attention. In this paper, a micro-model is developed to study the cathode/electrolyte interfacial stresses, coupling oxygen ion transport process with structural mechanics. Results indicate that the distributions of chemical stress are very complicated at the cathode/electrolyte interface and show different patterns from those of thermal stress. The maximum principal stresses take place at the cathode/electrolyte interface …