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A Study Aimed At Characterizing The Interfacial Structure In A Tin-Silver Solder On Nickel-Coated Copper Plate During Aging, D. C. Lin, R. Kovacevic, T. S. Srivatsan, Guo-Xiang Wang
A Study Aimed At Characterizing The Interfacial Structure In A Tin-Silver Solder On Nickel-Coated Copper Plate During Aging, D. C. Lin, R. Kovacevic, T. S. Srivatsan, Guo-Xiang Wang
Dr. Guo-Xiang Wang
This paper highlights the interfacial structure of tin-silver (Sn-3·5Ag) solder on nickel-coated copper pads during aging performance studies at a temperature of 150°C for up to 96 h. Experimental results revealed the as-solidified solder bump made from using the lead-free solder (Sn-3·5Ag) exhibited or showed a thin layer of the tin-nickel-copper intermetallic compound (IMC) at the solder/substrate interface. This includes a sub-layer having a planar structure immediately adjacent to the Ni-coating and a blocky structure on the inside of the solder. Aging performance studies revealed the thickness of both the IMC layer and the sub-layer, having a planar structure, to …