Digital Commons Network^™

Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and …

Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and …

Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate

A.S. Md Abdul Haseeb

Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and …

Static And Dynamic Components Of Droplet Friction, Peter Robert Griffiths

USF Tampa Graduate Theses and Dissertations

As digital microfluidics has continued to mature since its advent in the early 1980's, an increase in new and novel applications of this technology have been developed. However, even as this technology has become more common place, a consensus on the physics and force models of the motion of the contact line between the fluid, substrate, and ambient has not been reached. This uncertainty along with the dependence of the droplet geometry on the force to cause its motion has directed much of the research at specific geometries and droplet actuation methods.

The goal of this thesis is to help …

Electrochemical Explanation For Asymmetric Electrowetting Response, Mehdi Khodayari, Nathan B. Crane, Alex A. Volinsky

Faculty Publications

In electrowetting, a droplet/substrate contact angle is modulated by applying a potential difference between the droplet and the substrate. Typically, the droplet potential is changed via an auxiliary electrode dipped in the droplet. Here, it is shown that electrochemical reactions lead to a potential drop on the auxiliary electrode in electrowetting, which degrades the droplet contact angle modulation. The magnitude of this effect depends on the voltage polarity. This problem can be addressed by using a dielectric layer, such as SiO2, which can prevent electrochemical reactions with the electrowetting substrate and the auxiliary electrode.