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Addition Of Cobalt Nanoparticles Into Sn-3.8ag-0.7cu Lead-Free Solder By Paste Mixing
Addition Of Cobalt Nanoparticles Into Sn-3.8ag-0.7cu Lead-Free Solder By Paste Mixing
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn-3.8Ag-0.7Cu solder. Design/methodology/approach - Cobalt (Co) nanoparticles were added to Sn-Ag-Cu solders by thoroughly blending various weight percentages (0-2.0 wt%) of Co nanoparticles with near eutectic SAC387 solder paste. Blending was done mechanically for 30 min to ensure a homogeneous mixture. The paste mixture was then reflowed on a hot plate at 250°C for 45 s. The melting points of nanocomposite solder were determined by differential scanning calorimetry. Spreading rate of nanocomposite was calculated following the JIS Z3198-3 standard. …
Microstructure And Interface Characteristics Of B4c, Sic And Al2o3 Reinforced Al Matrix Composites: A Comparative Study
A.S. Md Abdul Haseeb
Three aluminium metal matrix composites containing reinforcing particles of B4C, SiC and Al2O3 (0-20vol.%) were processed. The stir-casting manufacturing route followed by hot extrusion was utilized, being one of the cost-effective industrial methods. A clear interfacial reaction product/layer was found at Al-SiC interface for composites held for a relatively long processing time (>30 min). No reaction product was observed at Al-B4C and Al-Al2O3 interfaces at the resolution limit of the SEM used. On the other hand, two secondary phases (alumina and another phase containing aluminium, boron and carbon) were found in the aluminum matrix away from the interface in …
Microstructure And Interface Characteristics Of B4c, Sic And Al2o3 Reinforced Al Matrix Composites: A Comparative Study
A.S. Md Abdul Haseeb
Three aluminium metal matrix composites containing reinforcing particles of B4C, SiC and Al2O3 (0-20vol.%) were processed. The stir-casting manufacturing route followed by hot extrusion was utilized, being one of the cost-effective industrial methods. A clear interfacial reaction product/layer was found at Al-SiC interface for composites held for a relatively long processing time (>30 min). No reaction product was observed at Al-B4C and Al-Al2O3 interfaces at the resolution limit of the SEM used. On the other hand, two secondary phases (alumina and another phase containing aluminium, boron and carbon) were found in the aluminum matrix away from the interface in …
An Experimental Study Of Molten Microdroplet Surface Deposition And Solidification: Transient Behavior And Wetting Angle Dynamics, Daniel Attinger, Z. Zhao, D. Poulikakos
An Experimental Study Of Molten Microdroplet Surface Deposition And Solidification: Transient Behavior And Wetting Angle Dynamics, Daniel Attinger, Z. Zhao, D. Poulikakos
Daniel Attinger
The basic problem of the impact and solidification of molten droplets on a substrate is of central importance to a host of processes. An important and novel such process in the area of micromanufacturing is solder jetting where microscopic solder droplets are dispensed for the attachment of microelectronic components. Despite the recent appearance of a few numerical studies focusing on the complex transient aspects of this process, no analogous experimental results have been reported to date to the best of our knowledge. Such a study is reported in this paper. Eutectic solder (63Sn37Pb) was melted to a preset superheat and …