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Analysis Of Printed Electronic Adhesion, Electrical, Mechanical, And Thermal Performance For Resilient Hybrid Electronics, Clayton Neff

USF Tampa Graduate Theses and Dissertations

Today’s state of the art additive manufacturing (AM) systems have the ability to fabricate multi-material devices with novel capabilities that were previously constrained by traditional manufacturing. AM machines fuse or deposit material in an additive fashion only where necessary, thus unlocking advantages of mass customization, no part-specific tooling, near arbitrary geometric complexity, and reduced lead times and cost. The combination of conductive ink micro-dispensing AM process with hybrid manufacturing processes including: laser machining, CNC machining, and pick & place enables the fabrication of printed electronics. Printed electronics exploit the integration of AM with hybrid processes and allow embedded and/or conformal …