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Effects Of Co Nanoparticle Addition To Sn-3.8ag-0.7cu Solder On Interfacial Structure After Reflow And Ageing
A.S. Md Abdul Haseeb
Effects of Co nanoparticle additions to Sn-3.8Ag-0.7Cu on the structure of solder/copper interface have been studied after reflow and high temperature ageing (150 °C, up to 1008 h). Results show that the Co nanoparticles substantially suppress the growth of Cu3Sn but enhance Cu 6Sn5 growth. Cobalt nanoparticles reduce interdiffusion coefficient in Cu3Sn. It is suggested that the Co nanoparticles undergo surface dissolution during reflow and exert their influence, at least partially, through alloying effect. © 2011 Elsevier Ltd. All rights reserved.
Interfacial Reaction And Dissolution Behavior Of Cu Substrate In Molten Sn-3.8ag-0.7cu In The Presence Of Mo Nanoparticles
A.S. Md Abdul Haseeb
Purpose - In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid-liquid interface. The purpose of this paper is to study the effect of the presence of molybdenum nanoparticles on the dissolution of copper and the formation of interfacial IMC. Design/methodology/approach - Cu wire having a diameter of 250 μm is immersed in liquid composite solders at 250° up to 15 min. Composite solder was prepared by adding various amount of Mo nanoparticles into the Sn-3.8Ag-0.7Cu (SAC) solder paste. The dissolution behavior of Cu substrate is …