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Chemo-Thermo Cure Of Viscoelastic Materials For Semiconductor Packaging Applications, Anjali Pradeep Kumar
Chemo-Thermo Cure Of Viscoelastic Materials For Semiconductor Packaging Applications, Anjali Pradeep Kumar
Dissertations and Theses
Viscoelastic polymer materials are being actively considered as a novel material for semiconductor packaging applications as a result of their ability to develop strong adhesive bonds at lower temperatures. Viscoelastic thermoset materials are impacted by the stresses generated during the curing process, which is also accompanied by a dissipation of thermal energy. There is a need to develop a generic modeling formulation that is applicable to any material of interest in order to enable the study of different bonding materials and develop optimized curing cycles. This study reports a numerical formulation to evaluate the stress generated and energy dissipated during …